Improving Dual V T Technology by Simultaneous Gate Sizing and Mechanical Stress Optimization

Junjun Gu,Gang Qu,Lin Yuan,Cheng Zhuo
DOI: https://doi.org/10.1109/iccad.2011.6105410
IF: 3.652
2011-01-01
Computer-Aided Design
Abstract:Process-induced mechanical stress is used to enhance carrier mobility and drive current in contemporary CMOS technologies. Stressed cells have reduced delay but larger leakage consumption. Its efficient power/delay trading ratio makes mechanical stress an enticing alternative to other power optimization techniques. This paper proposes an effective urgentpath guided approach that improves dual V t technique by incorporating gate sizing and mechanical stress simultaneously. The introduction of mechanical stress is shown to achieve 9.8% leakage and 2.8% total power savings over combined gate sizing and dual V t approach.
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