Abstract:In a recent study of diffusional creep in polycrystalline thin films deposited on substrates, we have discovered a new class of defects called the grain boundary diffusion wedges (Gao et al., Acta Mat. 47, pp. 2865–2878, 1999). These diffusion wedges are formed by stress driven mass transport between the free surface of the film and the grain boundaries during the process of substrate-constrained grain boundary diffusion. The mathematical modeling involves solution of integro-differential equations representing a strong coupling between elasticity and diffusion. The solution can be decomposed into diffusional eigenmodes reminiscent of crack-like opening displacement along the grain boundary which leads to a singular stress field at the root of the grain boundary. We find that the theoretical analysis successfully explains the difference between the mechanical behaviors of passivated and unpassivated copper films during thermal cycling on a silicon substrate. An important implication of our theoretical analysis is that dislocations with Burgers vector parallel to the interface can be nucleated at the root of the grain boundary. This is a new dislocation mechanism in thin films which contrasts to the well known Mathews-Freund-Nix mechanism of threading dislocation propagation. Recent TEM experiments at the Max Planck Institute for Metals Research have shown that, while threading dislocations dominate in passivated metal films, parallel glide dislocations begin to dominate in unpassivated copper films with thickness below 400 nm. This is consistent with our theoretical predictions. We have developed large scale molecular dynamics simulations of grain boundary diffusion wedges to clarify the nucleation mechanisms of parallel glide in thin films. Such atomic scale simulations of thin film diffusion not only show results which are consistent with both continuum theoretical and experimental studies, but also revealed the atomic processes of dislocation nucleation, climb, glide and storage in grain boundaries. The study should have far reaching implications for modeling deformation and diffusion in micro- and nanostructured materials.

Transient Stress Concentration in Diffusional Creep of A Thin Foil with Heterogeneous Grain Boundary Diffusivity

FORMATION OF CRACK-LIKE DIFFUSION WEDGES AND COMPRESSIVE STRESS EVOLUTION DURING THIN FILM GROWTH WITH INHOMOGENEOUS GRAIN BOUNDARY DIFFUSIVITY

Constrained Grain Boundary Diffusion in Thin Copper Films

Recoverable Creep Deformation and Transient Local Stress Concentration Due to Heterogeneous Grain-Boundary Diffusion and Sliding in Polycrystalline Solids

Atomistic and Continuum Studies of Diffusional Creep and Associated Dislocation Mechanisms in Thin Films on Substrates

Coupled Grain Boundary and Surface Diffusion in A Polycrystalline Thin Film Constrained by Substrate

A Discrete Dislocation Plasticity Model of Creep in Polycrystalline Thin Films

Atomistic and Continuum Studies of Crack-Like Diffusion Wedges and Associated Dislocation Mechanisms in Thin Films on Substrates

Evaluation of local stress state due to grain-boundary sliding during creep within a crystal plasticity finite element multi-scale framework

Effect and mechanism of constraint on creep crack growth behavior of GH3535 alloy

Finite Element Study of the Creep Size-Effect in Thin Metal Films

5542 - MULTI-SCALE MODELING OF DEFORMATION IN POLYCRYSTALLINE THIN METAL FILMS

A Constitutive Equation for Grain Boundary Sliding: An Experimental Approach

Analytical model of transient compressive stress evolution during growth of high diffusivity thin films on substrates

A coupled model of diffusional creep of polycrystalline solids based on climb of dislocations at grain boundaries

Grain boundary sliding and stress concentration during creep

Hierarchical Multi-Scale Modelling of Plasticity of Submicron Thin Metal Films

An Atomistic Study of Diffusion-Mediated Plasticity and Creep using Phase Field Crystal Methods

Influence of grain boundary activites on elastic and plastic deformation of nanocrystalline Cu as studied by phase filed and atomistic simulaiton

On stress concentration in nanotwinned metals

Size-dependent high temperature deformation and microstructure