Abstract:In a recent study of diffusional creep in polycrystalline thin films deposited on substrates, we have discovered a new class of defects called the grain boundary diffusion wedges (Gao et al., Acta Mat. 47, pp. 2865–2878, 1999). These diffusion wedges are formed by stress driven mass transport between the free surface of the film and the grain boundaries during the process of substrate-constrained grain boundary diffusion. The mathematical modeling involves solution of integro-differential equations representing a strong coupling between elasticity and diffusion. The solution can be decomposed into diffusional eigenmodes reminiscent of crack-like opening displacement along the grain boundary which leads to a singular stress field at the root of the grain boundary. We find that the theoretical analysis successfully explains the difference between the mechanical behaviors of passivated and unpassivated copper films during thermal cycling on a silicon substrate. An important implication of our theoretical analysis is that dislocations with Burgers vector parallel to the interface can be nucleated at the root of the grain boundary. This is a new dislocation mechanism in thin films which contrasts to the well known Mathews-Freund-Nix mechanism of threading dislocation propagation. Recent TEM experiments at the Max Planck Institute for Metals Research have shown that, while threading dislocations dominate in passivated metal films, parallel glide dislocations begin to dominate in unpassivated copper films with thickness below 400 nm. This is consistent with our theoretical predictions. We have developed large scale molecular dynamics simulations of grain boundary diffusion wedges to clarify the nucleation mechanisms of parallel glide in thin films. Such atomic scale simulations of thin film diffusion not only show results which are consistent with both continuum theoretical and experimental studies, but also revealed the atomic processes of dislocation nucleation, climb, glide and storage in grain boundaries. The study should have far reaching implications for modeling deformation and diffusion in micro- and nanostructured materials.

Analytical model of transient compressive stress evolution during growth of high diffusivity thin films on substrates

Confined Capillary Stresses During the Initial Growth of Thin Films on Amorphous Substrates

FORMATION OF CRACK-LIKE DIFFUSION WEDGES AND COMPRESSIVE STRESS EVOLUTION DURING THIN FILM GROWTH WITH INHOMOGENEOUS GRAIN BOUNDARY DIFFUSIVITY

A Numerical Study of Stress Controlled Surface Diffusion During Epitaxial Film Growth

A Simply Analytic Study of Buckled Thin Films on Compliant Substrates

5542 - MULTI-SCALE MODELING OF DEFORMATION IN POLYCRYSTALLINE THIN METAL FILMS

Multiscale Modeling of Deformation in Polycrystalline Thin Metal Films on Substrates

Atomistic and Continuum Studies of Diffusional Creep and Associated Dislocation Mechanisms in Thin Films on Substrates

Atomistic and Continuum Studies of Crack-Like Diffusion Wedges and Associated Dislocation Mechanisms in Thin Films on Substrates

THERMOELASTIC ANALYSIS OF INTERFACIAL STRESS AND STRESS SINGULARITY BETWEEN A THIN FILM AND ITS SUBSTRATE

A Dislocation Dynamics Based Higher-Order Crystal Plasticity Model and Applications on Confined Thin-Film Plasticity

Constrained Grain Boundary Diffusion in Thin Copper Films

Modeling and Characterization of Residual Stress Distribution of Thin Film/Substrate Structure with Non-negligible Film Thickness from Morphology

Some general properties of stress-driven surface evolution in a heteroepitaxial thin film structure

Dynamics of ultrathin metal films on amorphous substrates

Two-dimensional discrete dislocation models of deformation in polycrystalline thin metal films on substrates

Extension of the Stoney formula for the incremental stress of thin films

Coupled Grain Boundary and Surface Diffusion in A Polycrystalline Thin Film Constrained by Substrate

Elastic and elastic-plastic analysis of multilayer thin films filled with heterogeneous materials

Finite Element Study of the Creep Size-Effect in Thin Metal Films

Elastic constants and stress-strain in thin films: application in fiber-textured gold film by X-Ray diffraction