Novel Thermoelectric Materials Based on Boron-Doped Silicon Microchannel Plates

Pengliang Ci,Jing Shi,Fei Wang,Shaohui Xu,Zhenya Yang,Pingxiong Yang,Lianwei Wang,Paul K. Chu
DOI: https://doi.org/10.1016/j.matlet.2011.03.022
IF: 3
2011-01-01
Materials Letters
Abstract:The thermoelectric properties of boron-doped silicon microchannel plates (MCPs) were investigated. The samples were prepared by photo-assisted electrochemical etching (PAECE). The Seebeck coefficient and electrical resistivity at room temperature (25°C) were measured to determine the thermoelectric properties of the samples. In order to decrease the very high resistivity, boron doping was introduced and by modulating the doping time, a series of samples with different resistivity as well as Seebeck coefficient were obtained. Boron doping changed the electrical resistivity of the samples from 1.5×105Ωcm to 5.8×10−3Ωcm, and the absolute Seebeck coefficient deteriorated relatively slightly from 674μV/K to 159μV/K. According to the Seebeck coefficient and electrical conductivity, the power factor was calculated and a peak value of 4.7×10−1mWm−1K−2 was obtained. The results indicate that silicon MCPs doped with boron are promising silicon-based thermoelectric materials.
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