The use of the Bridgman method to obtain thermoelectric silicon doped with germanium and phosphorus
M. V. Dorokhin,,Yu. M. Kuznetsov,P. B. Demina,I. V. Erofeeva,A. V. Zdoroveyshchev,M. V. Ved’,D. A. Zdoroveyshchev,A. Yu. Zavrazhnov,I. N. Nekrylov,S. M. Peshcherova,R. V. Presnyakov,N. V. Sakharov,,,,,,,,,,,
DOI: https://doi.org/10.30791/1028-978x-2023-9-26-35
2023-01-01
Perspektivnye Materialy
Abstract:Heavily donor or acceptor doped metallurgical silicon is a promising candidate as a high-temperature thermoelectric energy converter due to the extremely low cost of its fabrication. The problem of silicon-based thermoelectric materials is the high value of the thermal conductivity; however, modern technologies offer several options for solving this problem at once. In the present work, silicon ingots heavily doped using Si:P compound were grown by the Bridgman directional crystallization method with a small (up to 5 at. %) germanium impurity fraction. The main thermoelectric parameters of the material were measured in a wide temperature range (50 – 800 °C). These are Seebeck coefficient, electrical conductivity and thermal conductivity. Based on the measurement results, the value of the thermoelectric figure of merit was calculated. The latter determines the value of the thermoelectric conversion efficiency. The study of electrical properties shows that phosphorus from the SiP compound is introduced into the lattice as a dopant and creates a high concentration of conduction electrons. The chemical analysis of the ingots showed the presence of additional background impurities, the concentration and composition of these impurities vary over the bulk of the sample. Despite the presence of impurities, the material demonstrates relatively high thermoelectric characteristics, and the efficiency is at the level of the best world results. A further potential for optimizing thermoelectric characteristics due to the possibility of a fine-grained polycrystalline structure formation is discussed.