Current Status and Future Trends of SiGe BiCMOS Technology

WANG Fei,XU Jun,LIU Dao-guang
DOI: https://doi.org/10.3969/j.issn.1004-3365.2006.05.002
2006-01-01
Abstract:The state-of-the-art and future direction of SiGe BiCMOS technology targeted for applications such as wireless communication are dealt with.The common aspects for device structure and process flow of SiGe HBT's are discussed.Based on IBM's 0.5 μm SiGe BiCMOS,the integration approach of SiGe BiCMOS is described in detail.Since BAG has decoupled the thermal budget of SiGe HBT and CMOS,feature size below 0.25 μm is becoming more popular.Finally,the roadmap of SiGe BiCMOS is summarized based on product lines of IBM and Jazz Semiconductor.
What problem does this paper attempt to address?