Abstract:Copper (Cu) has been widely used as interconnect materials in semiconductor industry, due to its advantages of high electrical, thermal conductivities, good electro-migration resistance and low cost. Since Cu is very reactive, contamination like physical diffusion from Cu to silicon (Si) and the chemical combination between Cu and Si is commonly observed and detrimental for Si semiconductor devices. Besides experimental study of the interaction between Cu and Si at macro scale, the physical diffusion and chemical combination also need to be understood at atomic level. Based on density functional theory (DFT), a crystal structure of Cu/Si heterojunction has been established to study the Cu/Si interfacial diffusion mechanism, including the diffusibility of vacancy and interstitial diffusion. No energy barrier exists when vacancy located at the top site, and diffusion from outside to bridge site is also possible by overcoming a relative low energy barrier. The occurrence of interstitial diffusion is also proved, but the energy barrier is higher than that of vacancy diffusion. The deeper of interstitial diffusion, more energy is required to overcome the increased energy barrier. In terms of first-principles study of chemical combination, complexes of Cu and Si have been structuralized in trigonal, hexagonal and tetragonal crystals. Stability of the crystal structures has been investigated from the aspect of mechanical and lattice stability. Tetragonal Cu3Si is proved to be the only crystal structure with both mechanical and lattice stabilities. The elastic constants, electronic structure and thermodynamical properties of the stable Cu3Si are also revealed. The results indicate the tetragonal Cu3Si exhibits metallic behaviors with good thermodynamical properties. The current study could provide meaningful insights on the inhabitation of Cu contamination and performance improvement.

Stimulatory Effect of Copper Ion on the Biosynthesis of the Novel Candicidin/Fr-008 Derivative Cs101 in A Mutant of Streptomyces Sp Fr-008

Novel meta-phase arising from large atomic size mismatch

First-principles Study of Copper Contamination in Silicon Semiconductor

Revealing Cation-Exchange-Induced Phase Transformations in Multielemental Chalcogenide Nanoparticles

Electrochemical Control of Copper Intercalation into Nanoscale Bi2Se3.

Reversible Structure Manipulation by Tuning Carrier Concentration in Metastable Cu2S.

Controllable Transformation from Rhombohedral Cu1.8S Nanocrystals to Hexagonal CuS Clusters: Phase- and Composition-Dependent Plasmonic Properties

Phase Control of Sulfide Nanocrystals from Thiourea-Mediated Solution

Composition and phase engineering of metal chalcogenides and phosphorous chalcogenides

Metal ion-dependent structural phase transition and impact of the Jahn–Teller effect in two organic–inorganic hybrid compounds

The Coupling of Local Strain and K + ‐Ion Release Induced Phase Transition Heterogeneity in Tunnel MnO 2

RealizingzT>2 in Environment‐Friendly Monoclinic Cu2S—Tetragonal Cu1.96S Nano‐Phase Junctions for Thermoelectrics

Micromechanism for Copper-Deficiency Enhanced Stability: A Quasi in Situ TEM Study of Electric-Induced Structural Evolution in Cu2-x (S, Se) Liquid-Like Thermoelectric Materials

Investigations on Electrical and Thermal Transport Properties of Cu2SnSe3 with Unusual Coexisting Nanophases

de Haas-van Alphen effect and the first-principles study of the possible topological stannide Cu3Sn

Room-temperature Protonation Induced High-Tc Phase in Iron-based Superconductors Evidenced by NMR and Magnetization Measurements

A Mixed-Valence {Fe13 } Cluster Exhibiting Metal-to-Metal Charge-Transfer-Switched Spin Crossover.

Copper ion dynamics and phase segregation in Cu-rich tetrahedrite: an NMR study

A Mixed-Valence {Fe<sub>13</sub>} Cluster Exhibiting Metal-to-Metal Charge-Transfer-Switched Spin Crossover

Enhancing Surface Strain of Intermetallic Fuel Cell Catalysts by Composition-Induced Phase Transition

Operando Multi-modal Synchrotron Investigation for Structural and Chemical Evolution of Cupric Sulfide (CuS) Additive in Li-S battery