CMOS ROIC for Solar-blind UVFPA and Preparation of Bump Interconnection

李高明,张景文,侯洵
DOI: https://doi.org/10.3969/j.issn.1672-8785.2009.03.002
2009-01-01
Abstract:The CMOS UVFPA which can be widely used in military,industry and agriculture has become a hot research subject in recent years.With the CMOS UVFPA,the solar-blind UV detection and visible light-blind detection can be implemented easily.However,in the development of the CMOS UVFPA,the Read Out Integrated Circuit(ROIC) is a very important restriction.The ROIC chip is an important part to implement signal output from detectors.For a hybrid CMOS UVFPA,its ROIC chip and detector array can be integrated with each other only by using the advanced microelectronic encapsulation process.In the integration process,a high density and high precision interconnection bump array should be fabricated.In this paper,the 16×16 bump arrays with the bump size of 30μm×30μm are fabricated respectively by using a evaporation plus lithography method and a electroplating method. The analysis of the quality of the bumps fabricated by using these two methods shows that the improved evaporation plus lithography method can be used to fabricate bumps with high quality.
What problem does this paper attempt to address?