Sb Grain Boundary Segregation in Rapidly Solidified Cu-Sb Alloy
Chunfei Li,Masashi Watanabe,John Li,David W. Ackland,David B. Williams
DOI: https://doi.org/10.1017/s1431927602104570
IF: 4.0991
2002-01-01
Microscopy and Microanalysis
Abstract:Journal Article Sb Grain Boundary Segregation in Rapidly Solidified Cu-Sb Alloy Get access Chunfei Li, Chunfei Li Material Science and Engineering Department, Lehigh University, Bethlehem, PA 18015 Search for other works by this author on: Oxford Academic Google Scholar Masashi Watanabe, Masashi Watanabe Material Science and Engineering Department, Lehigh University, Bethlehem, PA 18015 Search for other works by this author on: Oxford Academic Google Scholar John Li, John Li Semiconductor Research & Development Center, IBM Microelectronics, Semiconductor Research & Development Center, Hopewell Jct., NY 12533 Search for other works by this author on: Oxford Academic Google Scholar David W Ackland, David W Ackland Material Science and Engineering Department, Lehigh University, Bethlehem, PA 18015 Search for other works by this author on: Oxford Academic Google Scholar David B Williams David B Williams Material Science and Engineering Department, Lehigh University, Bethlehem, PA 18015 Search for other works by this author on: Oxford Academic Google Scholar Microscopy and Microanalysis, Volume 8, Issue S02, 1 August 2002, Pages 1598–1599, https://doi.org/10.1017/S1431927602104570 Published: 01 August 2002