Preparation and Self-Assembly of Copper Nanoparticles Via Discharge of Copper Rod Electrodes in a Surfactant Solution: a Combination of Physical and Chemical Processes

SY Xie,ZJ Ma,CF Wang,SC Lin,ZY Jiang,RB Huang,LS Zheng
DOI: https://doi.org/10.1016/j.jssc.2004.07.012
IF: 3.3
2004-01-01
Journal of Solid State Chemistry
Abstract:Cu nanoparticles with a mean diameter of 10–15 nm were prepared and self-assembled via discharge of bulk copper rods in a cetyltrimethylammonium bromide (CTAB)/ascorbic acid solution. Ascorbic acid was used as a protective agent to prevent the nascent Cu nanoparticles from oxidation in the solution; otherwise spindle-like Cu2O/CuO structures, with a lateral dimension of 30–50 nm and length of up to 100 nm, were formed in pure deionized water. The surfactant CTAB had a critical influence on self-assembly of spherical Cu nanostructures (with diameter of 700 nm–1 μm). Such a low-temperature and non-vacuum method, exhibiting the characters of both physical and chemical processes, provides a versatile choice for economical preparation and assembly of various metal nanostructures.
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