Highly Efficient Manifold Microchannel Heatsink

Y. Wang,G.-F Ding,S. Fu
DOI: https://doi.org/10.1049/el:20071325
2007-01-01
Electronics Letters
Abstract:A manifold microchannel heatsink with high local heat transfer efficiency is presented. CFX simulation indicates that the microchannel heatsink has higher heat transfer efficiency than the conventional structure. Infrared tests demonstrate the dependence of substrate steady-state temperature on flow rate, 0.64-6.7 ml/min, with heat flux of 104000 W/m(2). Maximum heat flux input, 203000 W/m(2), is obtained for 6.7 ml/min flow rate.
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