Abstract:It is highly desired to efficiently dissipate the high heat flux generated in electronics. A novel hybrid microchannel heat sink combining manifold with secondary oblique channels (MMC-SOC) has been proposed and studied numerically in our previous work. The current study conducts the fabrication and experimental test of the hybrid microchannel heat sink using dielectric fluid HFE-7100. The volume flow rate qv ranges from 211 to 580 mL/min, with channel Reynolds numbers between 278 and 905 for heat fluxes q'' = 20, 25, 30 and 35 W/cm2. The results indicate that the MMC-SOC heat sink can simultaneously reduce the thermal resistance Rt and pressure drop ∆P. For heat sinks with channel height Hc = 60 μm, an 11% reduction in ∆P and a 24% reduction in Rt are obtained compared to conventional manifold microchannel (MMC) heat sink for qv = 580 mL/min and q'' = 20 W/cm2. As qv increases, the ratio (Rt/Rt0) becomes smaller and (∆P/∆P0) becomes larger, which indicates an enhanced ability of reducing Rt and a suppressed ability of reducing ∆P. For the maximum qv = 580 mL/min and q'' = 35 W/cm2, the MMC-SOC heat sink can maintain a maximum chip temperature of 53 °C with a pressure drop of only 3.77 kPa. Moreover, the proposed MMC-SOC heat sink has a lower pressure drop compared to MMC heat sink owing to a reasonable design, even though the Reynolds number of the MMC-SOC heat sink reaches up to 883. This provides a very promising scheme for safe and efficient single-phase microchannel cooling used in the thermal management of electronics with high heat flux. In addition, the ratio (Rt/Rt0) will increase with increasing heat flux and increasing the flow rate becomes an effective way to further reduce the chip surface temperature at operating conditions with higher heat flux.

Toward extremely low thermal resistance with extremely low pumping power consumption for ultra-high heat flux removal on chip size scale

Efficient Thermal Management of High-Power Electronics Via Jet-Enhanced HU-type Manifold Microchannel

Investigation of Z-type Manifold Microchannel Cooling for Ultra-High Heat Flux Dissipation in Power Electronic Devices

An Experimental Study of Microchannel and Micro-Pin-Fin Based On-Chip Cooling Systems with Silicon-to-Silicon Direct Bonding.

Experimental investigation on thermal-hydraulic performance of manifold microchannel with pin-fins for ultra-high heat flux cooling

Embedded microfluidic cooling with compact double H type manifold microchannels for large-area high-power chips

Numerical investigation of novel manifold microchannel heat sinks with countercurrent regions

Topologically optimized manifold microchannel heat sink with extreme cooling performance for high heat flux cooling of electronics

Jet Microchannel with Sawtooth Wall for Efficient Cooling of High-Power Electronics

Numerical Study on Hybrid Discontinuous Microchannel Heat Sink Combining Manifold with Pin Fins (DMC-MPF) for High Power Electronic Device

An additively manufactured manifold-microchannel heat sink for high-heat flux cooling

Extremely high heat flux dissipation and hotspots removal with nature-inspired single-phase microchannel heat sink designs

High performance heat sink with counter flow diverging microchannels

Flow Boiling of HFE-7100 for Cooling Multi-Chip Modules Using Manifold Microchannels

Experimental study on single-phase hybrid microchannel cooling using HFE-7100 for liquid-cooled chips

Investigation of heat transfer performance of the manifold microchannel heat sink with different interface configurations

Micro Pin Fins with Topologically Optimized Configurations Enhance Flow Boiling Heat Transfer in Manifold Microchannel Heat Sinks

Integrated Manifold Microchannels and Near-Junction Cooling for Enhanced Thermal Management in 3D Heterogeneous Packaging Technology

Microchannel heat sinks for hotspot thermal management: achieving minimal pressure drop and maximal thermal performance

Experimental study of embedded manifold staggered pin-fin microchannel heat sink

Single-phase and Two-phase Flow and Heat Transfer in Microchannel Heat Sink with Various Manifold Arrangements