Process of Alkaline Cyanide-Free Copper Electroplating on Zinc-Based Alloy in Citrate-Tartrate Complex System
YANG Fang-zu,ZHAO Yuan,TIAN Zhong-qun,ZHOU Shao-min
DOI: https://doi.org/10.3969/j.issn.1001-3849.2010.11.002
2010-01-01
Abstract:The process of alkaline non-cyanide copper electroplating on zinc-based alloy substrate was studied by using citrate and tartrate as main complexing agents. The bath composition and operation conditions are as follows:CuCl2·2H2O 16 g/L,potassium citrate 82 g/L,sodium potassium tartrate 20 g/L,amine compound 29 g/L,H3BO3 30 g/L,KCl 28 g/L,KOH 20 g/L,brightening agent 0.01 mL/L,temperature 45 °C,pH 9 (adjusting with KOH or HCl),solution agitation and current density 1.0 A/dm2. The effects of agitation,bath temperature,pH,copper ions concentration and additive on the appearance of deposit were studied. The current efficiency,bath covering power and throwing power,impurity resistance,adhesion strength,surface morphology and structure were examined. The results showed that a bright copper deposit can be obtained with additives 0.01-1.5 mL/L. The current efficiency is increased with increasing current density,bath temperature and pH. The bath has good resistance to impurities,covering power 100%,throwing power 84.1% and current efficiency about 90%. The deposit is fine-grained,uniform,compact,smooth and well-adhered.