Abstract:The resource constraints and accuracy requirements for Internet of Things (IoT) memory chips need three-dimensional (3D) monolithic integrated circuits, of which the increasing stack layers (currently more than 176) also cause excessive energy consumption and increasing wire length. In this paper, a novel 3D wireless network on chips (3DWiNoCs) model transmitting signal directly to the destination in arbitrary layer is proposed and characterized. However, due to the the reflection and refraction characteristics in each layer, the complex and diverse wireless paths in 3DWiNoC add great difficulty to the channel characterization. To facilitate the modeling in massive layer NoC situation, both boundary-less model boundary-constrained 3DWiNoC model are proposed, of which the channel gain can be obtained by a computational efficient approximate algorithm. These 3DWiNoC models with approximation algorithm can well characterize the 3DWiNoC channel in aspect of complete reflection and refraction characteristics, and avoid massive wired connections, high power consumption of cross-layer communication and high-complexity of 3DWiNoC channel characterization. Numerical results show that: 1) The difference rate between the two models is lower than 0.001% (signal transmit through 20 layers); 2) the channel gain decreases sharply if refract time increases; and 3) the approximate algorithm can achieve an acceptable accuracy (error rate lower than 0.1%).

Research on Topologic Architecture of Three-Dimensional Network on Chip

Dual-Link Hierarchical Cluster-Based Interconnect Architecture for 3D Network on Chip

Towards 3-D Carbon-Based Heterogeneous Interconnects

Electrical Modeling of Three-Dimensional Carbon-Based Heterogeneous Interconnects

Dual-link interconnect architecture for 3-D Mesh-based network on chip

Performance Evaluation of Torus and Mesh in 3D Network-on-chip

Design of 3D NoC Network Architecture

Performance and power consumption analysis of memory efficient 3D network-on-chip architecture

Survey on the Networks-on-Chip Interconnection Topologies

Three-dimensional Integrated Circuits: Design, EDA, and Architecture

A survey on mapping and scheduling techniques for 3D Network-on-chip

Heterogeneous Design Methodology with Configurable Regular Topology Set for Scalable Network-on-Chip Designs

An Inductive-Coupling Interconnected Application-Specific 3D NoC Design.

A survey on scheduling and mapping techniques in 3D Network-on-chip

Lateral Asynchronous and Vertical Synchronous 3D Network on Chip with Double Pumped Vertical Links.

A hybird hierarchical architecture for 3D multi-cluster NoC

3D Wireless Channel Modeling for Multi-layer Network on Chip

Wireless Network-On-Chip: A Survey

Test Methodology of NoC with Irregular Topology

Design space exploration for 3D integrated circuits

Hierarchical Network-on-Chip Design Method