Abstract:Design and fabrication of the through-glass via (TGV) based three-dimensional (3D) spiral inductors in the fused silica substrates by a simpler electrochemical discharge machining (ECDM) is reported for the first time. The design of the spiral inductor was simulated using a high-frequency structure simulator to predict the S-parameters, inductance, and quality factor for a frequency up to 800 MHz. The 3D spiral inductors were designed with variable coil widths, i.e., 100 μm, 150 μm, and 200 μm, and a different number of turns from 3 to 6 turns. The through-holes having a diameter of 320 μm were etched in highly insulative 500 μm thick fused silica substrates in less than 7 min using a cost-effective ECDM technique. The through-holes were then completely filled with copper by bottom-up electrodeposition. Top and bottom side redistribution lines (RDL) were fabricated by standard through-photoresist electrodeposition process. Nanoindentation was carried out to ascertain the mechanical properties of the electrodeposited copper. The I–V characteristic showed perfect ohmic contact between the TGV and RDL. The quality factor and inductance of the fabricated 3D inductors were measured using a vector network analyzer. For an inductor coil having four turns and 150 μm width, the maximum quality factor was measured to be 11.6 at 440 MHz, while the measured inductance was 114.9 nH at 800 MHz. The experimental results were compared with the simulation results and were observed to be in good agreement. The fabricated inductors in fused silica substrates can be used in radio-frequency (RF) applications as an alternative to silicon-based inductors since it will have low substrate losses.

Fabrication and performance of a novel suspended RF spiral inductor

Fabrication and Performance of Novel RF Spiral Inductors on Silicon

High Performance MEMS Spiral Inductors

RF Inductors with Suspended and Copper Coated Thick Crystalline Silicon Spirals for Monolithic MEMS LC Circuits

Fabrication of High-Performance On-Chip Suspended Spiral Inductors by Micromachining and Electroless Copper Plating

PERFORMANCE TRENDS OF ON-CHIP SPIRAL INDUCTORS FOR RFICS

Combination of MEMS Processing and Electroless Copper Plating for a Novel RF Inductor

Design and Fabrication of the Suspended High-Q Spiral Inductors with X-Beams

RF Performances of MEMS Suspended Inductor under High Overload Environments

A Practical Suspended Spiral Inductor for MMIC Application

High Q-factor CMOS-MEMS inductor

Design, Fabrication and Characterization of a Novel TSV Interposer Integrated Inductor for RF Applications

A Novel Local-Dielectric-Thickening Technique for Performance Improvements of Spiral Inductors on Si Substrates

RF Circular Spiral Inductors Fabricated on Silicon with Backside Subtracted

Characterization of Flexible Radio-Frequency Spiral Inductors on a Plastic Substrate.

Ni-Zn Ferrite Film Coated On-Chip Rf Inductor Fabricated by A Novel Powder-Mixed-Photoresist Coating Technique

Modeling and Simulation of Spiral Inductors in Wafer Level Packaged RF/Wireless Chips

MEMS-based Fabrication of High-Performance Inductors with Back Hollow Structure and Ferromagnetic Film

Nano-powder-magnetic-core vertically stacked-spiral RF inductor in CMOS

3-D Microinductor Fabricated by Using MEMS Technology

Design and fabrication of through-glass via (TGV) based 3D spiral inductors in fused silica substrate