Abstract:Polyimide-block-poly(dimethyl siloxane) copolymer was synthesized by a two-step process, initiated by coupling anhydride terminated poly(amic acid), AT-PAA with amino terminated poly(dimethyl siloxane), (NH 2 ) 2 -PDMS to form poly(amic acid)-block-poly(dimethyl siloxane). The resulting copolymer is then thermally treated to produce polyimide-block-poly(dimethyl siloxane), PI-PDMS. Because of the high glass transition temperature, Tg of polyimide, it is usually cured at a high temperature of about 300°C for over 2.5 h. Copolymerization of polyimide with polysiloxane, reduces the imidization temperature while maintaining high thermomechanical properties. A series of instruments were used to monitor the progress of copolymerization. The time-based analysis of the product of copolymerization enables the optimization of the structure and properties of the copolymers. The chemical structure and composition of the copolymer were studied by Fourier Transform Infrared Spectroscopy, (FT-IR). The incorporation of PDMS blocks into the copolymer and the degree of imidization of the polyimide block increased with increasing reaction time. The change in the viscosity of the copolymerizing solution was monitored by simple shear viscometry conducted with the Brookfield Viscometer. The reported increase in solution viscosity with increasing copolymerization time is associated with increasing molecular weight of the copolymer. The intrinsic viscosity of the copolymer solution was measured as a function of copolymerization time and it was found that the intrinsic viscosity of the copolymer solution increased with increasing reaction time. The glass transition temperature (Tg) and the thermal stability of the copolymer were determined by differential scanning calorimetry, DSC and thermogravimetric analysis, and TGA, respectively. Between 25°C and 420°C, the copolymers synthesized in this study show two glass transition temperatures due to the polyimide, PI block at around 380°C and another peak associated with PDMS plasticized polyimide at about 290–300°C. The two Tg peaks observed in the DSC thermogram are believed to be indicative of the structure of a block copolymer. TGA analysis shows that the thermoxidative stability of the copolymers increased with increasing reaction time, due to the incorporation of increased amount of PDMS unit into the copolymer. The combination of increasing molecular weight of copolymer, higher degree of imidization of polyimide blocks and enhanced thermoxidative stability may translate into improved flame retardancy of copolymers. This suggested enhancement in flame retardancy in air atmosphere, is believed to be due the incorporated PDMS blocks, which can be converted into silica, SiO2, a recognized thermally stable material.

Thermal Degradation Kinetics of Polyimide Containing 2,6-Benzobisoxazole Units

THERMAL DEGRADATION KINETICS OF POLY(BENZOBISOXAZOLE IMIDE)

Characterization and Thermal Degradation of Polyimide Derived from 5-Amino-2(p-aminophenyl) Benzoxazole Monomer with Pyromellitic Dianhydride

Synthesis and Characterization of Polyimide Containing 2,6-Benzobisoxazole Units

Study on Syntheses and Properties of Some Novel Polyimides Containing Bisthiazole Rings

Structure and Properties of Thermoplastic Polyimide Based on 4', 4'-(Oxybis (methylene)) Bis ([1.1'- Bipheny]3-Amine) Diamine

Synthesis and Characterization of Polyimides Derived from 5-Amino-2(p-aminophenyl) Benzoxazole Monomer

Synthesis and Characterization of Biphenyl Polyimide Containing Alkyl Sulfide Structure

Synthesis and Properties of Some New Polyimides Containing Bithiazole Rings

Cure Kinetics and Thermal Decomposition Behavior of Novel Phenylacetylene-Capped Polyimide Resins

Synthesis and Characterization of Polyimide from Hydrogenated Pyromellitic Anhydride

Thermal Degradation Mechanism and Thermal Mechanical Properties of Two High-Performance Aromatic Polyimide Fibers

Polymerization, Structure and Thermal Properties of Odpa-Dmb Polyimide Films

Syntheses and Properties of Polyimides Derived from 2,5-Bis(4-aminophenyl)pyrimidine

Incorporating bis-benzimidazole into polyimide chains for effectively improving thermal resistance and dimensional stability

Phenylethynyl-terminated Oligoimides Based on Bis(p-Aminophenoxy)dimethyl Silane: Effect of Siloxane Structure on Processability and Thermal Stability

Thermal Degradation of Organo-Soluble Polyimides

Two Step Synthesis of Hydroxyl Group Polyimide Based on 2,2-Bis(amino-4-hydroxyphenyl)hexafluoropropane

Novel Polyimide-block-poly(dimethyl siloxane) copolymers: Effect of time on the synthesis and thermal properties

Organosoluble semi-alicyclic polyimides derived from 3,4-dicarboxy-1,2,3,4- tetrahydro-6-tert-butyl-1-naphthalene succinic dianhydride and aromatic diamines: Synthesis, characterization and thermal degradation investigation

The Pivotal Role of Benzimidazole in Improving the Thermal and Dielectric Performance of Upilex-Type Polyimide