Abstract:Pure copper and copper-carbon composite films have been deposited on silicon substrates by sputtering of a copper target associated with microwave plasma-enhanced chemical vapor deposition process of carbon from argon-methane mixtures of various compositions. The composition of films was determined by Rutherford backscattering spectroscopy (RBS) and Raman spectroscopy. The morphology of the surface and cross-section of samples was examined by scanning electron microscopy. The crystallographic structure was identified by x-ray diffraction techniques. The electrical resistivity of films was obtained by four point probe measurements. These composite films consisted of polycrystalline copper and amorphous carbon phase. The copper crystallite size was in the range 15-30 nm and less than 5 nm for a carbon content in Cu-C films ranging from 20 to 25 at. % and from 60 to 75 at. %, respectively. The electrical resistivity of Cu- C films containing 20 to 25 at. % of carbon was approximately 2.5 µΩ cm whereas the resistivity value can reach 10 7 µΩ cm for films containing 60 to 75 at. % of carbon. A large variation of grain size and electrical resistivity of nanostructured Cu-C composite thin films was noticed as the CH 4 concentration in the gas phase was varied from 60 to 70 %. The hardness and Young modulus of films were deduced from nanoindentation measurements. The friction coefficient of films was determined by pin-on-disk tribological tests conducted under various conditions. The deposition rate, composition, morphology, structure, electrical resistivity, mechanical properties and friction properties of films were investigated as functions of the methane concentration in the gas phase or carbon content in the Cu-C composite films.

Metal Copper Films Coated on Microparticle Substrates Using an Ultrasonic-Assisted Magnetron Sputtering System

Plating Metal Film on the Surface of Carborundum Particles by Magnetron Sputtering Method

Metal Copper Films Deposited on Cenosphere Particles by Magnetron Sputtering Method

The Growth Mechanism of Copper Films Coated on Cenosphere Particles Using Magnetron Sputtering Method

Preparation and Characterization of Metal-coated Micro-particles by Magnetron Sputtering

Fabrication and Structural Characterization of Metal Films Coated on Cenosphere Particles by Magnetron Sputtering Deposition

Cu Films Deposited by Unbalanced Magnetron Sputtering Enhanced by ICP and External Magnetic Field Confinement

Structure and Properties of Electrocodeposited Cu-Al2o3 Nanocomposite Thin Films

Self-formed Submicron-Scale Faceted Copper Particles on the Surface of Annealed Cu-Zr Films

Chemical Bonding of Magnetron-Sputtered Copper on Pecvd Amorphous Sicof Film

Surface Morphology And Interface Reaction Of Cu/Sio2/Si (111) Systems Prepared By Radio Frequency Magnetron Sputtering

On the Microcrystal Structure of Sputtered Cu Films Deposited on Si(100) Surfaces: Experiment and Integrated Multiscale Simulation

Fluidized Bed Chemical Vapor Deposition of Copper on Micronic Alumina Powders

Chemical Vapor Deposition Mechanism of Copper Films on Silicon Substrates

Copper Thin Film Deposition by An Indigenous Unbalanced Type DC Magnetron Sputtering System

Coating Metals on Micropowders by Magnetron Sputtering

A Method to Prepare Nano-Sized Copper Particles and Rods on the Surface of Cu Composite Films

The microstructure and properties of copper coating fabricated by high velocity arc spraying

One‐step Electroless Synthesis and Properties of Copper Film Deposited on Silicon Substrate

PREPARATION, STRUCTURE AND MECHANICAL PROPERTIES OF NANOSTRUCTURED COPPER-CARBON FILMS