Abstract:The evolution of surface morphologies of films prepared by ion-based deposition techniques has been investigated by atomic force microscopy. Two deposition processes, filtered arc deposition (FAD) and ion-beam-assisted deposition, where low-energy (<100 eV) ion irradiation and high-energy (several tens of keV) ion-beam bombardment concurrent with film growth were involved, respectively, have been employed to prepare TiN and Al films. Comparative studies on the effect of energetic ions on the development of topography have been performed between the low-ion-energy regime and high-ion-energy regime. In addition, the relationship between topography and mechanical properties of thin films has been revealed, by involving thin films prepared by thermal evaporation deposition (TED), where almost all depositing particles are neutral. In the images of the TED TiN and Al films, a large number of porous and deep boundaries between columnar grains was observed, suggesting a very rough and loose surface. In contrast, the FAD films exhibited much denser surface morphologies, although still columnar. The root-mean-square roughness of the FAD films was less than 1 Å. Hardness test and optical parameter measurement indicated that the FAD films were much harder and, in the case of optical films, much more transparent than the TED films, which was considered to arise from the denser surface morphologies rather than crystallization of the films. The high density and super smoothness of the FAD films, and the resultant mechanical and optical properties superior to those of the TED films, were attributed to the enhancement of surface migration of the deposited adatoms in the FAD process, which could provide intensive low-energy ion irradiation during film growth. As for topography modification by high-energy ion-beam bombardment concurrent with film growth, in addition to the increase of surface diffusion due to elastic collision and thermal spikes, physical sputtering must be considered while explaining the development of the film topography. Both surface migration enhancement and sputtering played important roles in the case of high-energy heavy-ion-beam bombardment, under which condition surface morphology characterized by dense columns with larger dimension and deep clean boundaries was formed. However, under high-energy light-ion-beam bombardment, the sputtering was dominant, and the variation of sputtering coefficient with position on the surface of growing film led to the formation of cones.

A study of the stress and resistivity of Al/Ti films deposited by an ion beam assisted process for surface acoustic wave devices applications

Ion bombardment-induced high orientation of Al/Ti films for surface acoustic wave device applications

Analysis of stress in TiO2 thin film prepared with ion assisted deposition

Effect of Temperature on Residual Stress and Mechanical Properties of Ti Films Prepared by Both Ion Implantation and Ion Beam Assisted Deposition

Residual Stresses And Debonding Of Diamond Films On Titanium Alloy Substrates

Atomic Force Microscopy Study on Topography of Films Produced by Ion-Based Techniques

Film thickness effect on texture and residual stress sign transition in sputtered TiN thin films

Influence of Residual Stress on Mechanical Properties of TiAlN Thin Films

Significant Enhancement in Electromigration Resistance and Texture of Aluminum Films Using an Ultrathin Titanium Underlayer

Analysis of Residual Stress of Gradient TiAlN Films Prepared by Arc Ion Plating

Experimental and Numerical Evaluations of Adhesion Strength and Stress in Tin Films Deposited on Ti-Implanted Aluminum

Investigation of the characteristics of TiN-coating film deposited by arc ion plating method and the feasibility of measuring residual stress according to heat treatment

Mechanical Properties and Thermal Stability of TiAlN/Ta Multilayer Film Deposited by Ion Beam Assisted Deposition

Measurements of Residual Stresses in Al Film/silicon Nitride Substrate Microcantilever Beam Systems

Improvement in Power Durability of Al Electrode Films Used in SAW Devices by Zr Additive and Ti Underlayer

Highly Orientated Al Film Grown on LiNbO_3 by Ion Beam Assisted Deposition

Effects of crystal orientation, substrate type, and substrate temperature on residual stress of AlN thin films deposited by different deposition methods

Neutron diffraction residual stress determinations in titanium aluminide component fabricated using the twin wire-arc additive manufacturing

Influence of sputtering parameters on structures and residual stress of AlN films deposited by DC reactive magnetron sputtering at room temperature

Effect of Ion Beam Bombardment on the Properties of Ni Films Deposited on Polyimide by Ion Beam Assisted Deposition

Experimental and Thermal Stress Field Numerical Simulation Study on Laser Metal Deposition of Ti-48Al-2Cr-2Nb Alloy