Effects of Fe(III) and Cu(I) on Electrodeposition and Microstructure Characterization for Acid Plating Bath
Jing Xiang,Yingjie Wang,Chong Zeng,Yonggang Xu,Wenyao Yang,LiangLiang Tian,Haibo Ruan,Qiang Yang
DOI: https://doi.org/10.1007/s12678-022-00743-5
2022-06-30
Electrocatalysis
Abstract:Electrodeposited copper is a very critical technology for 3D interconnection structure to ensure the stability of signal transmission in IC package substrate. However, Cu(I) produces during long-term electrodeposition and has an obvious adverse effect on the surface microstructure and brightness of electrodeposited copper. In this paper, Fe(III) was introduced into the electrodeposited copper system to solve the negative effect of Cu(I) on the electrodeposited copper layer and improve the surface performance of copper layer. The galvanostatic measurement (GM), cyclic voltammetry (CV), electrochemical impedance spectroscopy (EIS), and polarization curves were used to explore the effect of Cu(I) and Fe(III) on the electrochemical behaviors of the electrolyte system. Simultaneously, the surface microscopic characterization and brightness of the copper layers were observed by scanning electron microscope (SEM), camera, diffraction of x-rays (XRD), and 3D confocal laser microscope (3D-CLM). Finally, the results showed that Fe(III) improved the surface microstructure, recovered brightness of copper layer, and restored the ratio of the copper crystal planes (200) and (220).
chemistry, physical,electrochemistry