Studies of Several Pickling and Activation Processes for Electroless Ni-P Plating on AZ31 Magnesium Alloy
Zhi-Hui Xie,Fang Chen,Shu-Rong Xiang,Jun-Li Zhou,Zheng-Wei Song,Gang Yu
DOI: https://doi.org/10.1149/2.0601503jes
IF: 3.9
2014-01-01
Journal of The Electrochemical Society
Abstract:Several chromium-free pickling and activation processes were investigated in order to develop an eco-friendly pretreatment for electroless Ni-P plating on magnesium alloy. The coatings obtained from etching only in H3PO4 solution exhibit poor adhesion due to the existance of an interlayer. Meanwhile, a corrosion model of Mg alloy in H3PO4 solution was proposed. When fluoride was added into the pickling solution, the adhesion of the coatings was also unsatisfied because of the bad mechanical interlocking action. By comparison, the coatings obtained from pickling in H3PO4 solution followed by NH4HF2 activation displayed wonderful properties in both adhesion and corrosion resistance. (C) The Author(s) 2014. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial No Derivatives 4.0 License (CC BY-NC-ND, http://creativecommons.org/licenses/by-nc-nd/4.0/), which permits non-commercial reuse, distribution, and reproduction in any medium, provided the original work is not changed in any way and is properly cited. For permission for commercial reuse, please email: oa@electrochem.org. All rights reserved.