Studies on the Effect of Plating Parameters on Tin-Lead Alloy Electroplating in Alkylsulfonate Baths

LIAO Xiao-zhen,TAO Rong,JIANG Chun-bao

DOI: https://doi.org/10.3969/j.issn.1004-227x.2000.01.009

2000-01-01

Abstract:The effects of bath composition, cathodic current density and temperature of alkylsulfonate base tin-lead alloy electroplating on tin content and thickness of electrodeposits were studied through Hull cell test.

What problem does this paper attempt to address?

Lead-tin alloy electroplating applied to superconducting resonator

Fei ZHU,Jian ZHENG,Zhao-hua PENG,Ai-ling LI,Li-peng ZHOU,Yue-ming HU

DOI: https://doi.org/10.19289/j.1004-227x.2017.17.004

2017-01-01

Abstract:The effects of mass concentrations of main salts,methanesulfonic acid and OP-10 as well as current density on Pb-Sn alloy electroplating were studied by Hull cell test.The optimal bath composition and process conditions were obtained as follows:lead methanesulfonate 48-96 g/L,tin methanesulfonate 6.5-13.0 g/L,methanesulfonic acid 50-200 g/L,OP-10 5 g/L,hydroquinone 1 g/L,and current density 0.135-3.077 A/dm2.The Pb-Sn alloy coating obtained under the optimal conditions is bright and compact,featuring uniform grain size and good mechanical stability.The alloy coating is in superconducting state with a resistance close to zero at a temperature of 7.2 K,meeting the performance requirements of superconducting resonator.
Study of tin-cerium alloy electroplating using ultrasonic

Hua-mao CHEN,Hua-qiang WU

DOI: https://doi.org/10.3969/j.issn.1004-227X.2005.06.009

2005-01-01

Abstract:Abstrcat Tin-cerium alloy deposit is of excellent prospect due to its good properties. Ultrasonic is used for tin-cerium alloy electroplating. The optimum bath formula and process conditions were obtained by Hull Cell test. The corrosion resistance test of the deposits obtained under different ultrasonic power measured by dipping in hydrochloric acid shows that the corrosion resistance of the deposits is improved with increase of ultrasonic power. The properties of the bath and deposits when using ultrasonic were tested and compared with those without using ultrasonic. The results indicate that when ultrasonic is applicable to the tin-cerium alloy electroplating, the range of current density and temperature are widened, and the deposits have dense and uniform surface, fine crystal, and better oxidation resistance, corrosion resistance and weldability. Moreover, the performances of the bath are improved with a covering power of 100% and cathodic current efficiency and deposition rate increased.
Impact and Removal of Iron Impurity in Acid Tin Plating Bath

WANG Xiao-wei,CAO Li-xin,YU Yuan-chun,ZHANG Jing-shuang

DOI: https://doi.org/10.3969/j.issn.1000-4742.2008.01.006

2008-01-01

Abstract:The effects of addition of TTHA to acid tin plating bath at different current densities on the efficiency in removing Fe~(2+) and on coating quality are investigated in Hull cell.The coating corrosion resistance is tested by salt spray and Tafel polarization.The results show that iron impurity and its negative effects on coating quality can be effectively eliminated by lower current density and addtion of TTHA,and a silvery white coating can thus be obtained.In addition,the deferential capacitance curves of TTHA on dropping mercury electrode are determined by using AC bridge deferential capacitance curves measuring method.The acting mechanism of TTHA is also proposed and discussed.
Effects Of Plating Parameters On The Au-Sn Co-Electrodepositon For Flip Chip-Led Bumps

JianLing Pan,Mingliang Huang,Song Pan

DOI: https://doi.org/10.1109/ICEPT.2011.6067022

2011-01-01

Abstract:The Au-Sn alloy was successfully pulse electrodeposited in a new non-cyanide and non-toxic stable electroplating bath which basically was composed of Au compound and tin sulfate (SnSO4). The composition and morphology of electrodeposited Au-Sn alloy were investigated in terms of current density, temperature and pH value in the developed bath. It was possible to control tin content in the electrodeposits by means of current density. Au-Sn alloy with Sn concentration of about 20 to 45 at.% was deposited at peak current density ranging from 3 mA/cm(2) to 45 mA/cm(2). Although the microstructure and surface morphology of the electrodeposits were influenced by the peak current density, dense and smooth Au-Sn films with fine grain had been electroplated at different current density. With increasing pH value, the tin content in the alloy was obviously increased from about 10 to 45 at.%. When the pH value was greater than 8.5, the deposits became porous and incompact mainly owing to the hydrogen evolution reaction during plating. With increasing temperature, the tin content was slightly changed, however, the grain size became bigger and the films had a tendency towards coarser because of the rapid consumption of metallic ions. Therefore, it can be concluded that the optimum condition of pH value for electroplating of Au-Sn alloys was ranging from 7.5 to 8 and that of temperature was 35 to 45 degrees C.
Effect of tin on PbO film in lead alloy anode of lead acid batteries

YANG Xi-wen,TANG You-gen,SHEN Jian-bin

DOI: https://doi.org/10.3969/j.issn.1001-1579.2006.03.029

2006-01-01

Abstract:The effects of alloying tin in lead alloy on the conductivity and thickness of oxidation film were summarized.The forms of tin [Sn(Ⅱ),Sn(Ⅲ) and Sn(Ⅳ)] and their positions in the oxidation film were discussed.According to the analysis of mechanism and formation process of the passive layer,the analysis was made on the influence of tin content to the conductivity and thickness of the oxidation film of lead alloy.
Effect of Plating Parameters on Plating Rate and Thickness As Well As Surface Morphology of Electroless Tin Coating

徐磊,何捍卫,周科朝,刘洪江

DOI: https://doi.org/10.16577/j.cnki.42-1215/tb.2009.05.019

2009-01-01

Abstract:In order to realize continuous tin electroless plating and increase the deposition rate, a new method was established. The effects of plating parameters (such as bath composition, pH val-ue, temperature, plating time, and stirring rate) on the surface morphology and thickness of the coating were investigated by means of scanning electron microscopy (SEM) , X-ray diffraction (XRD) , energy dispersive spectrometry (EDX) , and chemical analysis. Results show that the optimal temperature and pH value for tin electroless plating were determined to be 80～ 85 ℃ and 0.6 ～0.8, and the optimized bath was composed of 20.0～25.0 g/L SnCl2, 70. 0 ～ 75. 0 g/L ( NH2 )2 CS, 70.0 ～ 75. 0 g/L NaH2P02 ? 2H2 0, 75. 0 ～ 80. 0 g/L H2SO4, 5. 0～ 8. 0 g/L CH4O3S,5.0～8.0g/L EDTA, 2.0～4.0g/L C6H6O2, 10.0～15.0 g/L C2H6O2, 0.5 ～1.0 g/L H3P04, 0.5 -1.0 mL/L HCHO, and 1.0 g/L OP-10. Using the established tech-nology, it was feasible to conduct continuous tin electroless plat-ing, and the thickness of the coating after 3 hour of continuous plating was as much as 32.72 μm.
Effects of Technological Parameters on the Morphology and Corrosion Resistance of Alloy Layer in Electrotinning

黄久贵,李宁,朱晓东,周德瑞

DOI: https://doi.org/10.3969/j.issn.1000-4742.2004.01.002

2004-01-01

Abstract:The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning. Therefore, both the base plate and coating have a great bearing on the formation of alloy layer, of which the corrosion resistance is directly related to the life of tinplate as a food packaging material. For this reason, the effects of electroplating technological parameters on tin coating, especially on Sn-Fe alloy layer and its corrosion resistance are studied through quadrature experiment; and the optimal concentration of each component in Ferrostan electrolyte and optimum current density are determined. The research results also show that the bigger the grains of alloy layer and the neater their arrangement are, the better the corrosion resistance of tin plate will be.
A Study of Methylsulfonate Sn-Ag Alloy Plating

LI Li-qing

DOI: https://doi.org/10.3969/j.issn.1000-4742.2005.06.002

2005-01-01

Abstract:With the rapid development of electronic electroplating industry,there are increasingly stringent requirements on the quality of the claddings,especially on the weldability.An environment-friendly plating process is developed.The weldability of the tin-silver alloy cladding is very nice,and the stability of the plating solution is very good.It provides a new direction for the development of weldable claddings.
A Study of Additives for Methanesulfonic Acid Tin Plating

HU Li-xin,CHENG Jiao,WANG Xiao-yan,OU-YANG Gui,CHEN Xue-mei

DOI: https://doi.org/10.3969/j.issn.1000-4742.2011.01.004

2011-01-01

Abstract:A new methanesulfonic acid tin plating process was researched.The effects of the additive on the process of tin electrodeposition and surface morphology were examined by polarization curve,scanning electron microscope and X-ray diffraction analysis,at the same time,the mechanism of the additive was discussed.The results show that the throwing power of the bath is 58.98 % and the covering power is 100 %;the cathodic polarization was improved by presence of the additive, which can block active sites for tin deposition and improve the quality of the deposits;moreover,the preferential orientation of crystalline tin grains is(211) and(112) faces.
Effects of Bath Temperature on Co-Electroplating Au-Sn Alloys for Electronic Packaging

Fangwu Tang,Mingliang Huang,Feifei Huang

DOI: https://doi.org/10.1109/icept.2016.7583140

2016-01-01

Abstract:Au-30at.%Sn eutectic alloy is useful in electronics for its superior mechanical and thermal conduction properties. Compared with traditional methods (Au-Sn solder preform and evaporation), the electroplating is an attractive method to obtain Au-Sn solder due to its cost-effective. In this work, Au-Sn films were co-electroplated via a pyrophosphate based bath. Electrochemical studies have been conducted to examine the effects of bath temperature on plating process. It was found that the rate for deposition of Au-Sn alloys was increased with bath temperature increased. Besides, the effects of bath temperature on the morphology and composition of electrodeposits were discussed.
Effect Of Agitation On Tin-Lead Alloy Deposition In A Methane Sulfonate System

C. S. Chen,C. C. Wan,Y. Y. Wang

2001-01-01

Abstract:Tin/lead alloy electrodeposition within methane sulfonic acid (MSA) solutions was studied, The thickness and composition of the deposit formed under static condition were investigated initially, then contrasted with the data obtained under a reflow system. It was found that when the electrolyte was stagnant, the high current area appeared on the edge region of the electrode surface where the lead deposition dominates, while the central region of the plate was the low current area that facilitated the tin deposition. Moreover, the increase of flow rate could significantly improve the distribution of Pb/Sn, although it had little effect on the composition of the deposition, which was mainly controlled by current density. Finally, the Pb/Sn alloy deposition in a MSA bath was found to be mainly controlled by the mass transfer of active ions, So the flow pattern and circulation greatly affect the current distribution of the alloy deposition. The flow pattern with a certain cell can be accurately simulated by mathematical modeling with the assistance of appropriate flow 3D software.
Effects of Electroplating Parameters on Composition and Morphology of Au-Sn Alloy Films

Feifei Huang,Mingliang Huang

DOI: https://doi.org/10.1109/icept56209.2022.9873530

2022-01-01

Abstract:A non-cyanide Au-Sn alloy electroplating bath with high stability was developed. The bath used 5,5-dimethyl hydantoin (DMH) and K 4 P 2 O 7 as the major complexing agents for gold and tin ions. Na 2 SO 3 was a synergetic complexing agent for gold ion. Moreover, bath stabilizer and antioxidant were also added. Effects of the concentration ratio of gold ion and stannous ion and concentration of complexing agents and stabilizer on the composition and morphology of Au-Sn electrodeposits were studied. The concentration ratio of gold ion and stannous ion has a notable influence on the composition and morphology of Au-Sn electrodeposited alloy films. When the concentration ratio of gold to tin ion ranged from 1:2 to 1:4, the Sn content increased from 10 at.% to 48 at.% and the grains of Au-Sn alloys changed from needle-like to fine then to granular at the current density of 25 mA/cm 2 . When the molar ratios of Na 2 SO 3 to gold ion increased from 6:1 to 30:1, the Sn content decreased from 37at.% to 25at.% and the Au-Sn electrodeposits showed smooth morphology when the concentration ratio of Na 2 SO 3 to gold ion ranged from 6:1 to 24:1. The Sn content decreased with the increasing concentration ratio of ${{\text{P}}_2}{\text{O}}_7^{4 - }$ to Sn(II). Moreover, when the concentration ratio of ${{\text{P}}_2}{\text{O}}_7^{4 - }$ and Sn(II) ranged from 1:6 to 1:9, the grain size of Au-Sn alloy films were fine. Moreover, smooth surface morphologies were obtained. The Sn content decreased with the increasing stabilizer concentration and smooth surface morphologies were obtained with the stabilizer concentration varied from 0.01 mol/L to 0.02 mol/L.
Pretreatment of Aluminum Alloy for Electroless Nickel Plation and Study of Bath Stability

CHEN Yu,L(U) Guang-shu,CAI Gang-yi

DOI: https://doi.org/10.3969/j.issn.1004-227x.2007.06.006

2007-01-01

Abstract:Two different activating methods and one alkaline pre-nickel plating method were used as pretreatment techniques of aluminum alloy for electroless nickel plating.SEM photos obtained with the three processes were analyzed,and the effects of several additives such as thiourea,potash iodate,potassium nitrate and lead ion on bath stability and plating rate were studied.The results show that the Ni-P coating obtained after alkaline pre-nickel plating has the best quality,with even coating and good adhesion;the bath stability improves with increasing additive content;a proper concentration of KIO3 and Pb 2+ can remarkably enhance the bath stability with a plating rate to meet the needs of production.
A Study of the Plating Process for Preparing Sn-Cu Lead-Free Solders by Electrodeposition

王亚平,张亚辉,程应武,邓朝阳,邓晓亮,曾德长

DOI: https://doi.org/10.3969/j.issn.1000-4742.2009.03.002

2009-01-01

Abstract:Sn-Cu lead-free solders possess excellent physical and chemical properties.Electrodeposition of tin-copper films from electrolytes with citric acid as complexant has been investigated.Scanning electron microscope(SEM),energy dispersive X-ray spectroscopy(EDS) and X-ray diffraction(XRD) were employed to analyze and characterize the deposits,and cathodic polarization curves was applied to study the electroplating mechanism.The results show that Sn-Cu films with mass fraction of 99% Sn,composed of Sn and Cu_6Sn_5 crystals,can be obtained by electrodeposition.
Study of zinc-nickel-phosphorus alloy electroplating

Qin XIE,Yu-de SHU,Yun-yan WANG

DOI: https://doi.org/10.3969/j.issn.1004-227X.2001.01.004

2001-01-01

Abstract:Zinc-nickel-phosphorus alloy plating in simple chloride bath was studied.The effect of bath components and plating parameters on nickel and phosphorus content in the obtained alloy deposits was studied, and corrosion resistance of the obtained alloy deposits was tested. The results show that corrosion resistance of zinc-nickel-phosphorus alloy deposits is superior to that of zinc-nickel alloy deposits which is in direct ratio to the phosphorus content in alloy deposits.
Study of Electroless Ni-Zn-P Alloy Plating from Acidic Bath

WANG Dian-long,GONG Yu-mei

2009-01-01

Abstract:The electroless Ni-Zn-P alloy deposit was prepared from a sulphate bath. The effects of the process parameters (Zn 2+ and additive concentration,pH) on the plating rate and coating corrosion potential were examined. Tafel plot of the deposit was tested in the mass fraction of 3.5 % sodium chloride solution. Corrosion resistance of the deposit was evaluated by electrochemical impedance methods.The results show that when in the mass fraction of 3.5 % sodium chloride solution,the coating corrosion potential is-0.600 9 V vs. SCE,258 mV lower than the corrosion potential of electroless Ni-P alloy.
Electrodeposition of Ni-W Alloy in Sulphate System

Lin-chao LI,Hui-li HU,Shuang LIU

DOI: https://doi.org/10.16490/j.cnki.issn.1001-3660.2017.07.014

2017-01-01

Surface Technology

Abstract:The work aims to explore effects of citric acid concentration, sodium tungstate concentration in sulphate bath as well as plating heat treatment process on tungsten content in nickel tungsten alloy plating, plating hardness, plating microstruc-ture and phase composition. Ni-W alloy platings of certain thickness were prepared different bath composition on low carbon steel in alloy electrodeposition method. Later the platings were treated in different heat treatment processes. Microstructure of the platings was observed with scanning electron microscopy (SEM) , and tungsten content of the plating was detected by its built-in EDS energy spectrum. Phase composition, grain size and lattice distortion of the platings were analyzed by X-ray dif-fractometer (XRD). Hardness of the alloy platings was tested with micro hardness tester. With the increase of sodium tungstate concentration or decrease of citric acid concentration in the bath, tungsten content in the plating increased, grain size decreased and Vickers hardness increased. Heat treatment atmosphere had little effect on hardness of the platings, but it could change mi-crostructure of the platings, hardness of the platings first increased and then decreased with the increase of heat treatment tem-perature and holding time. When the bath contains 45 g/L sodium tungstate and 45 g/L citric acid, the obtained plating is substi- tutional sosoloid Ni17W3 with Ni as solvent and W as solute. In this process, the plating is smooth and crack-free, and hardness of the plating is 894 HV0.1 after later heat treatment for 1.5 h under the protection of argon at 400℃ .
Effect of Tin Ion Additive on Zinc Electrode in Alkaline Solution

Yong-feng YUAN,Jiang-ping TU,Hui-ming WU,Yang LI,Xin-bing ZHAO

DOI: https://doi.org/10.3321/j.issn:0529-6579.2005.z2.013

2005-01-01

Abstract:Co-deposition of zincate and tin ion on zinc electrode were conducted to investigate the effect of tin ion on electro-deposition of zincate. The results showed that the deposit morphology of zincate changed from dendrite to many small compact crystallites in a spongy array. With increasing tin ion additive, zinc dendrite was dramatically inhibited. The precise mechanism of inhibition was discussed. In addition to the deposition of tin on preferred growth sites blocking further zinc deposition, the high deposition over-potential on tin is an important factor.
Primary study for the technology of electroless plating Fe-Al-P alloys

Lingling Wang,Lihua Zhao,Wangyu Hu,Xiaolin Shu,XiaoJian Yuan,Bangwei Zhang,Xia Sheng

1999-01-01

Acta Metallurgica Sinica (English Letters)

Abstract:The Fe-Al-P alloy deposits were plated on copper sheets by electroless plating. The change law of the deposition rate, composition, surface appearance and structure for the deposits was studied by changing the metallic salt ratios (AlCl3/AlCl3+FeSO4), the concentration of metallic salt AlCl3 and reductant NaH2PO2. The optimum plating bath was obtained. It was found that the choices of ligand and reductant are the key of increasing Al content for the deposits.
Deposition kinetics of tin-lead alloy on rotating disk electrode in methane sulfonate bath

CS Chen,CC Wan,YY Wang

1999-01-01

Journal of the Chinese Institute of Chemical Engineers

Abstract:This study examined the electrochemical behavior of electrodeposition of tin, lead, and tin-lead alloys on a rotating disk electrode in methane sulfonate acid solution (MSA). Also investigated herein was how cathodic potential, rotating speed and concentration influence the composition of deposits. When the lead content in a bath was controlled at 0.0075M and exceeded 25mol. % of the total metal ion content, lead deposited preferentially. In a bath below 25mol. % lead, the deposit's major component was tin. At approximately 25mol. % lead, the deposit had the same ratio of tin and lead as in the solution. In this case, the deposit's composition became independent of the applied potential.

Studies on the Effect of Plating Parameters on Tin-Lead Alloy Electroplating in Alkylsulfonate Baths

Lead-tin alloy electroplating applied to superconducting resonator

Study of tin-cerium alloy electroplating using ultrasonic

Impact and Removal of Iron Impurity in Acid Tin Plating Bath

Effects Of Plating Parameters On The Au-Sn Co-Electrodepositon For Flip Chip-Led Bumps

Effect of tin on PbO film in lead alloy anode of lead acid batteries

Effect of Plating Parameters on Plating Rate and Thickness As Well As Surface Morphology of Electroless Tin Coating

Effects of Technological Parameters on the Morphology and Corrosion Resistance of Alloy Layer in Electrotinning

A Study of Methylsulfonate Sn-Ag Alloy Plating

A Study of Additives for Methanesulfonic Acid Tin Plating

Effects of Bath Temperature on Co-Electroplating Au-Sn Alloys for Electronic Packaging

Effect Of Agitation On Tin-Lead Alloy Deposition In A Methane Sulfonate System

Effects of Electroplating Parameters on Composition and Morphology of Au-Sn Alloy Films

Pretreatment of Aluminum Alloy for Electroless Nickel Plation and Study of Bath Stability

A Study of the Plating Process for Preparing Sn-Cu Lead-Free Solders by Electrodeposition

Study of zinc-nickel-phosphorus alloy electroplating

Study of Electroless Ni-Zn-P Alloy Plating from Acidic Bath

Electrodeposition of Ni-W Alloy in Sulphate System

Effect of Tin Ion Additive on Zinc Electrode in Alkaline Solution

Primary study for the technology of electroless plating Fe-Al-P alloys

Deposition kinetics of tin-lead alloy on rotating disk electrode in methane sulfonate bath