Ceramic Packaging by Localized Induction Heating

刘文明,陈明祥,刘胜
DOI: https://doi.org/10.3969/j.issn.1672-6030.2009.04.018
2009-01-01
Nanotechnology and Precision Engineering
Abstract:In order to protect the circuit in package and the thermal-sensitive devices at the bottom of the ceramic crust from high-temperature damage,high frequency localized induction heating technology was applied to packaging the ceramic crust.It took only about 5 s to complete the packaging process.The temperatures on the cover edges near the solder-loop and at the bottom of the ceramic package were about 320 ℃ and 100 ℃,respectively.The local temperature variation,temperature distribution,hermetic test,tensile strength and fracture analysis in this packaging process were tested and evaluated by infrared thermal imager,helium mass spectrometry detector,six-axis tester and three-dimensional microscope.Results show that due to the solder reflow,hermetic seal of the ceramic package is accomplished.In addition,a tensile strength in the range of 4.0 MPa—16.0 MPa is achieved,which depends on the induction heating time and packaging pressure.Finally,longer heating time will lead to the overflow of the solder.
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