Surface Modification of Poly(tetrafluoroethylene) Films by Plasma Polymerization and UV-induced Graft Copolymerization for Adhesion Enhancement with Electrolessly-Deposited Copper

GH Yang,ET Kang,KG Neoh
DOI: https://doi.org/10.1163/156856101750430459
IF: 2.431
2001-01-01
Journal of Adhesion Science and Technology
Abstract:Surface modification of H2 plasma-pretreated poly(tetrafluoroethylene) (PTFE) films, either by plasma polymerization and deposition of GMA, or by UV-induced graft copolymerization with glycidyl methacrylate (GMA), was carried out for adhesion enhancement with the electrolesslydeposited copper. XPS and FTIR results revealed that the epoxide groups in the plasma-polymerized GMA (pp-GMA) layer had been preserved to various extents, depending on the glow discharge conditions. The T-peel adhesion test results showed that the adhesion strengths of the electrolesslydeposited copper on both the pp-GMA modified PTFE (pp-GMA-PTFE) film and the GMA graftcopolymerized PTFE (GMA-g-PTFE) film were much higher than that of the electrolessly-deposited copper on the pristine or the H2 plasma-treated PTFE film. The high adhesion strength between the electrolessly-deposited copper and the surface-modified PTFE film was attributed to the fact that the plasma-polymerized and the UV graft-copolymerized GMA chains were covalently tethered on the H2 plasma-pretreated PTFE surface, as well as the fact that these GMA chains were spatially and interactively distributed into the copper matrix.
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