Numerical Investigation of Substrate Melting and Deformation During Thermal Spray Coating by SPH Method

Mingyu Zhang,Hui Zhang,Lili Zheng
DOI: https://doi.org/10.1007/s11090-008-9158-7
2008-01-01
Plasma Chemistry and Plasma Processing
Abstract:The fluid–solid coupling model is developed to simulate substrate melting and deformation during molten droplet impact. In this model, the liquid and solid parts of splat and substrate are governed by the SPH formulations of the Navier–Stokes equations and the conservation equations of continuum mechanics, respectively. This is the first time that the fluid–solid coupling by the SPH method is applied to simulation of the interaction between droplet and substrate during thermal spray coating. The simulation results on formation of the crater are presented to study the Ni droplet impacting onto the Sn substrate, and Mo droplet impacting onto the Steel, Al, and Brass substrates, respectively. It is found that the initial temperatures and thermal properties of droplet and substrate have great effects on the substrate melting and the morphologies of the splat and the substrate.
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