Abstract:Currently, the field of microgear manufacturing faces various processing challenges, particularly in terms of size reduction; these challenges increase the complexity and costs of manufacturing. In this study, a technique for microgear manufacturing is aimed at reducing subsequent processing steps and enhancing material utilization. This technique involves the use of trough dies with extrusion-cutting processing, which enables workpieces to undergo forming in a negative clearance state, thus reducing subsequent processing time for micro products. We conducted finite element simulations using microgear dies, measuring stress, velocity, and flow during the forming process of four types of dies-flat, internal-trough, external-trough, and double-trough dies. The results indicated that the buffering effect of the troughs reduced the rate of increase in the material's internal stress. In the cavity, the material experiences a significant increase in hydrostatic pressure, leading to the formation of a "hydrostatic pressure wall". This pressure barrier imposes substantial constraints on the flow of the material during dynamic processes, making it difficult for the material to move into the remaining areas. This effectively enhances the blockage of material flow, demonstrating the critical role of hydrostatic pressure in controlling material distribution and movement. In addition, combining the characteristics of both into a double-trough die enhances the overall stability of forming velocity, reduces forming load and energy consumption, and maximizes material utilization. Results further revealed that microgears manufactured using double-trough dies exhibited defect-free surfaces, with a dimensional error of less than 5 μm and tolerances ranging from IT5 to IT6. Overall, this study offers new insights into the traditional field of microgear manufacturing, highlighting potential solutions for the challenges encountered in current microstamping processes.

Precision Micro-Punching Process of T2 Copper Foil

Applying punching without die to micro-hole array processing

Simulation Analysis of Upper Mould Base for High Speed Punch

Study on the forming of complex shaped microparts by progressive micropunching of thin copper strip

Mass copper micro-embossing by tungsten die for MEMS applications

Improving the Forming Quality of Laser Dynamic Flexible Micropunching by Laser Pre-Shocking

A novel punching process with electronically permanent magnetic technology

The Stamping Method Utilizing a Double-Trough Die in Microforming to Enhance Formability

Design of Micro-blanking and Stamping Mold for Dish-shaped Parts

Failure and forming quality study of metallic foil blanking with different punch-die clearances

Research on Ecm Process of Micro Holes with Internal Features

Fabrication of Micro-Punch Array by Plasma Printing for Micro-Embossing into Copper Substrates

Experimental investigations of electromagnetic punching process in CFRP laminate

Micro-punching process based on spallation delamination induced by laser driven-flyer

Demolding Defects and the Design of Demolding Device in Micro Hot Embossing Process

Numerical simulation and optimization of fine-blanking process for copper alloy sheet

Multiphysics Research on Electrochemical Machining of Micro Holes with Internal Features

Formability improvement of hot embossing for functional micro-array structures with a novel exhaust punch

Research on the Micro Sheet Stamping Process Using Plasticine as Soft Punch

Numerical simulation of fine-blanking process using a mixed finite element method

Fabrication of Punch and Die Using Plasma-Assisted 3D Printing Technology for Piercing Sheet Metals