Abstract:The patterning of semiconductors with complex 3D hierarchical structures having sub-100 nm resolution is propelling a new generation of optical metasurfaces for applications in optoelectronic interconnects and hyperspectral imaging. These complex structures are now manufacturable with the advent of Metal-assisted chemical imprinting (Mac-Imprint). This technique involves bringing a 3D patterned catalytic stamp into contact with a semiconductor substrate in the presence of an etching solution. Recently, a novel class of catalytic stamps made of Au-coated porous polymeric membranes was developed in order to allow for etching solution storage and mass-transport of the reactants, all of which are essential for fast and accurate Mac-Imprint. Further, the flexibility and stretchability of these porous membranes allows for the use of pressure-based actuation to bring both planar and non-planar substrates in conformal contact with the stamp, replicating the set-up of modern nanoimprinting lithography equipment. Due to the contact-based nature of the Mac-Imprint process, it is vital to understand the mechanical behavior of the stamp. Thus, this work attempts to computationally elucidate the mechanical behavior of the stamp during conformal Mac- Imprint. In particular, the elastic behavior of a stamps laminate made of commercial porous polyvinylidene fluoride (PVDF) with nominal pore sizes of 100 nm and solid polyimide (PI) is modelled using finite element analysis (FEA) in a commercial ANSYS software with material constants, extracted via uniaxial tensile test. The FEA prediction using 2D axisymmetric model is able to capture the induced biaxial stress, strain, deflection and yield of the porous PVDF. To validate simulation results, a deflection test was experimentally performed as a function of air pressure and the obtained results matched with the FEA simulation.

Probing Polymer Deformation Profiles at Varying Depths in Nanoimprint Lithography

Polymer Pen Chemical Lift-Off Lithography

Polymer Viscoelasticity and Residual Stress Effects on Nanoimprint Lithography

Investigation of Resist Filling Behavior in Microimprint Lithography by Computational Fluid Dynamics Simulation and Defocusing Digital Particle Image Velocimetry

Vertical pattern decay and lateral in-phase capillary breakup of nanoimprinted bilayer polymer films

Study of Elastic Modulus and Yield Strength of Polymer Thin Films Using Atomic Force Microscopy

Coarse-Grain Simulations of the Polymer Filling Process in Nanolithography

Resist deformation and flow fields in microimprint lithography

Effects of Mold Geometries and Initial Resist Thickness on Filling Behavior in UV-Nanoimprint Lithography

Molecular dynamics simulation study of the degradation of polymer nanopatterns created by nanoimprint

A Sandwiched Flexible Polymer Mold for Control of Particle-Induced Defects in Nanoimprint Lithography

Hydrodynamic and Solid Mechanics Analysis of Capillary Force-Induced Mold Deformation in Sub-10 nm UV Nanoimprint Lithography

Nanoimprint Lithography and the Role of Viscoelasticity in the Generation of Residual Stress in Model Polystyrene Patterns

Impact of process parameters on the flow behavior and filling accuracy of photoresist in hot embossing for microgroove array

Hydrodynamics and solid mechanics structural analysis of mold deformation in nanoimprint lithography

A novel non-chemically amplified resist based on polystyrene-iodonium derivatives for electron beam lithography

Effect of the Molecular Weight on Deformation States of the Polystyrene Film by AFM Single Scanning.

PMMA resist profile and proximity effect dependence on the electron-beam lithography process parameters

Understanding mechanical response of porous polymeric stamps during large-area metal-assisted chemical imprinting of silicon

A New Strategy of Lithography Based on Phase Separation of Polymer Blends

Topographically Uniform but Chemically Heterogeneous Nanostructures by Nanoimprinting Demixed Polymer Blends