Damage Nucleation During Electromigration along an Isolated Interface in an Elastic Medium

MD Thouless,HH Yu,ZJ Zhao,W Yang
DOI: https://doi.org/10.1016/0022-5096(95)00077-1
IF: 5.582
1996-01-01
Journal of the Mechanics and Physics of Solids
Abstract:This paper examines the effect of an elastic constraint on electromigration along an isolated interface embedded in an elastic matrix. The evolution of the stresses and the distribution of matter were analyzed, so as to develop models for the nucleation of damage, It was found that the steady-state stress distribution is linear along the conducting region of the boundary. However, there is an inverse square-root singular stress immediately outside this region. Therefore, a stress-intensity factor can be defined which, upon being equated to the fracture toughness of the surrounding material, results in a prediction for a critical line length for cracking of the passivation. This critical line length scales as E(-2/3), where E is the electric field.In contrast to previous analyses, the distribution of matter along the boundary has been shown not to be monotonic along the boundary, even in steady stale. Instead, there are maxima and minima at some distance removed from both ends. The stress and matter distributions can be combined to predict a condition for void nucleation based on a first-principles calculation. The predicted critical length scales as E(-3/4); its magnitude is in good agreement with experimental observations for the critical line length made by other authors.
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