D. Stöffler,M. Marz,B. Kießig,T. Tomanic,R. Schäfer,H. v. Löhneysen,R. Hoffmann-Vogel
Abstract:The electrical resistance R of metallic nanocontacts subjected to controlled cyclic electromigration in ultra-high vacuum has been investigated in-situ as a function of applied voltage V. For sufficiently small contacts, i.e., large resistance, a decrease of R(V) while increasing V is observed. This effect is tentatively attributed to the presence of contacts separated by thin vacuum barriers in parallel to ohmic nanocontacts. Simple model calculations indicate that both thermal activation or tunneling can lead to this unusual behavior. We describe our data by a tunneling model whose key parameter, i.e., the tunneling distance, changes because of thermal expansion due to Joule heating and/or electrostatic strain arising from the applied voltage. Oxygen exposure during electromigration prevents the formation of negative R(V) slopes, and at the same time enhances the probability of uncontrolled melting, while other gases show little effects. In addition, indication for field emission has been observed in some samples
What problem does this paper attempt to address?
The problem that this paper attempts to solve is that when studying metal nano - contact points through the electromigration (EM) process under ultra - high - vacuum conditions, abnormal behavior is observed in the resistance - voltage relationship (\(R(V)\)). Specifically, when the applied voltage increases, it is usually expected that the resistance will increase or remain unchanged due to the Joule heating effect, but in the experiment, the phenomenon that the resistance decreases as the voltage increases, that is, a negative slope of \(R(V)\), has been observed. This abnormal phenomenon has been found on different metals and substrates and is related to the gas components in the environment (especially oxygen).
The main objectives of the paper are:
1. **Explain the negative - slope phenomenon**: Explore the possible mechanisms leading to the negative slope of \(R(V)\), especially the tunneling effect and the existence of tiny gaps parallel to the metal contact points.
2. **Analyze the influence of gases**: Study the influence of different gases (such as oxygen, hydrogen, etc.) on the electromigration process, especially how oxygen inhibits the formation of the negative slope while increasing the probability of contact point breakage.
3. **Establish a model**: Through the fitting of theoretical models and experimental data, explain the non - linear relationship between resistance and voltage, and explore the reasons for the change of tunneling distance with voltage, including the influence of thermal expansion and electrostatic stress.
Through these studies, the author hopes to gain an in - depth understanding of the electron - transfer mechanism of metal contact points at the nano - scale and the properties of the tiny gaps formed during the electromigration process, which is of great significance for molecular electronics and other nano - technology applications.