Abstract:We present an efficient method for evaluating current-induced forces in nanoscale junctions, which naturally integrates into the nonequilibrium Green's function formalism implemented within density functional theory. This allows us to perform dynamic atomic relaxation in the presence of an electric current while evaluating the current-voltage characteristics. The central idea consists of expressing the system energy density matrix in terms of Green's functions. To validate our implementation, we perform a series of benchmark calculations, both at zero and at finite bias. First we evaluate the current-induced forces acting over an Al nanowire and compare them with previously published results for fixed geometries. Then we perform structural relaxation of the same wires under bias and determine the critical voltage at which they break. We find that although a perfectly straight wire does not break at any of the voltages considered, a zigzag wire is more fragile and snaps at 1.4 V, with the Al atoms moving against the electron flow. The critical current density for the rupture is estimated to be 9.6 x 10(10) A/cm(2), in good agreement with the experimentally measured value of 5 x 10(10) A/cm(2). Finally, we demonstrate the capability of our scheme to tackle the electromigration problem by studying the current-induced motion of a single Si atom covalently attached to the sidewall of a (4,4) armchair single-walled carbon nanotube. Our calculations indicate that if Si is attached along the current path, then current-induced forces can induce migration. In contrast, if the bonding site is away from the current path, then the adatom remains stable regardless of the voltage. An analysis based on decomposing the total force into a wind and an electrostatic component, as well as on a detailed evaluation of the bond currents, shows that this remarkable electromigration phenomenon is due solely to the position-dependent wind force.

Electrical transport characteristics of atomic contact and nanogap dynamically formed by electromigration

Fringing Field Effects on Electrical Resistivity of Semiconductor Nanowire-Metal Contacts

Electromigration-Induced Evolution of Micromorphology and Electrical Properties in Gold Nanowires: Implications for Nanoelectronics

Comparison of the Time-Dependent Physical Processes in the Electromigration of Deep Submicron Copper and Aluminum Interconnects

Phase-Field-Crystal Model for Electromigration in Metal Interconnects.

Role of Stress-Driven Interfacial Instability in the Failure of Confined Electric Interconnects

Understanding the Impact of Surface Engineering, Structure, and Design on Electromigration Through Monte Carlo Simulation and In‐Situ SEM Studies

Electromigration of Cu-Ni/Solder/Ni-Cu structures

Atomic-Scale Investigation of Electromigration with Different Directions of Electron Flow into High-Density Nanotwinned Copper through In Situ HRTEM

Dynamic investigation of interface atom migration during heterostructure nanojoining.

Theoretical Understanding of Electromigration-Related Surface Diffusion and Current-Induced Force in Ag–Pd Systems

Structure and local charging of electromigrated Au nanocontacts

Current-Induced Energy Barrier Suppression For Electromigration From First Principles

Atomic discreteness and the nature of structural equilibrium in conductance histograms of electromigrated Cu-nanocontacts

Electromigration prediction and test for 0.18μm power technology in wafer level reliability

Dependence of electromigration caused by different mechanisms on current densities in VLSI interconnects

Current-Induced Changes of Surface Morphology in Printed Ag Thin Wires

The Study of the Reliability of Complex Components during the Electromigration Process

Aluminum migration on the die surfaces of a power transistor in high-intensity electric fields

Grain boundaries-dominated migration failure of copper interconnect under multiphysics field: Insight from theoretical modeling and finite element analysis

Resistometric Study on Electromigration Failure in Copper Interconnects