Finite element simulation of temperature fields of gypsum wallboard in heat pump drying process

ZHU Gui-hua,XuGuang Gao,Kang Li,HU Jun-ping,Jiangsan He
2010-01-01
Abstract:Based on the fact that gypsum wallboard mainly relies on natural air-drying or simple tunnel drying with high energy consumption method,heat pump technology was applied to dry gypsum wallboard and a heat pump drying device was designed to control the drying chamber inlet temperature constant,and the procedure was analyzed.ANSYS thermal analysis module was used to simulate the distribution of transient temperature field of the internal gypsum wallboard in the drying process when the drying chamber for the intake air temperature was 70 ℃.The results show that the temperature of gypsum wallboard goes up fast at the pre-heating stage,the high temperature zone is mainly the outside surface’s corner region;at medium-term heating stage,the internal temperature of gypsum wallboard rises slowly.After 6 h,the temperature of gypsum wallboard is the same as the loading temperature;the bottom of rabbet of wallboard that is the thickest part of gypsum wallboard reaches the final steady-state temperature;in the direction of the length of gypsum wallboard middle temperature gradient is 0 basically.Changes of temperature field from simulation of temperature field offer references for improving the drying device and the drying process.
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