Drying parameters optimization of gypsum-based wallboard heat pump drying system by simulation

ZHU Gui-hua,GAO Xu-guang,LI Kang

DOI: https://doi.org/10.3969/j.issn.2095-6835.2010.22.001

2010-01-01

Abstract:In the present study,heat pump drying technology was applied to dry gypsum-based wallboard,and the relevant parameters of the wall heat pump drying was introduced,then three different drying programs about the drying chamber’intake air temperature 70℃,and air velocity 2m / s,3m / s,4m / s were set.On this basis,ANSYS thermal analysis module was used to simulate the temperature versus time curve of the different nodes in the wall under the three kinds of conditions of heating and drying dry wall,simulation results showed that:air temperature 70℃ and flow 3m / s can meet the heat required for drying of the wall,narrow the difference in temperature between different parts of the internal wall panels as much as possible,have a higher heating and drying efficiency,and ensure high-quality dry wall panels,efficient heating.This program over the other two programs has an obvious advantage,and provides a basis for heat pump drying equipment design and drying process design.