Abstract:With the rapid development of key industries such as new energy vehicles, smart homes, smart phones and consumer grade drones, the demand for high performance miniature micro- pressure sensors is also growing promptly. At prssent, most of the pressure sensors of this type adopt a C-type structure, and the thickness of the sensitive diaphragm needs to be continuously thinned in order to improve the sensitivity of this type sensor, which leads to its sensitivity to etching errors and makes it difficult to ensure the linearity of the pressure sensor. Based on this, we designed a miniature micro-pressure half active Wheatstone bridge piezoresistive pressure sensor with C-type square diaphragm structure, whose area is reduced by shortening the number of leads and pads, through ion impantation on the surface of the diaphragm to create a piezoresistors, using deep reactive ion etching (DRIE) technology to release the pressure sensitive diaphragm with length of 460 μm × 460 μm, thinkness of 7.5 μm. The buried oxygen layer in the SOI(silicon on insulator) can play a role of stopping the etching, which assures the uniformity of the released sensitive diaphragm and the non-linear errors of the sensor while maintains its sensitivity. In this paper, the influence of piezoresistor position offset on the performance of the pressure sensor is analyzed by means of simulation, which improves the accuracy of the designed model and guarantees its performance parameters can meet the design indicators. Finally, the static characteristics of the sensor is calibrated. The experimental results show that the sensitivity of the sensor is up to 0.538 mV kPa-1/3.5 V in the range of 40 kPa at room temperature, and the non-linear error is only 0.386 % FS. This study provides some new ideas and references for the design work of high performance micro-pressure sensors.

A Novel Pressure Sensor Structure for Integrated Sensors

A Novel Structure of Pressure Sensors

A Novel Integrated Silicon Micro-Mechanical Optical Pressure Sensor

A Novel Combined Pressure/Temperature Microsensor

A Novel Pressure Microsensor with 30- $\mu \Hbox{m}$-Thick Diaphragm and Meander-Shaped Piezoresistors Partially Distributed on High-Stress Bulk Silicon Region

A Novel Peninsula-island Structure for Sensing Ultra-low Pressure Based on Dry-wet Combination Etching Process.

The Novel Structural Design for Pressure Sensors

A Novel Piezoresistive Sensitive Structure for Micromachined High-Pressure Sensors.

A New Silicon Diaphragm Pressure Sensor and Its Stress Analysis

A High Sensitive Pressure Sensor with the Novel Bossed Diaphragm Combined with Peninsula-Island Structure

Silicon Micromachined TSVs for Backside Interconnection of Ultra-Small Pressure Sensors

A Novel Packaging Structure and Process for High Temperature Silicon Piezoresistive Pressure Sensor

Laterally Driven Resonant Pressure Sensor with Etched Silicon Dual Diaphragms and Combined Beams

A Novel Resonant Pressure Sensor with Boron Diffused Silicon Resonator

Realization and Characterization of a Bulk-Type All-Silicon High Pressure Sensor

Design and fabrication of a tiny micro-pressure sensor with improved linearity and sensitivity

Flexible and Highly Sensitive Pressure Sensors Based on Microstructured Carbon Nanowalls Electrodes

The Design and Optimization of a Highly Sensitive and Overload-Resistant Piezoresistive Pressure Sensor.

A Novel Dual-Functional MEMS Sensor Integrating Both Pressure and Temperature Units

A Novel Monolithically Integrated Pressure, Accelerometer and Temperature Composite Sensor

Characterization and Analysis of a Novel Structural SOI Piezoresistive Pressure Sensor with High Sensitivity and Linearity