Brazing of diamond to invar with Ag-Cu-Ti filler alloy: Wettability, microstructure and mechanical performance
Yulong Li,Qi Wu,Wei Lin,Haoyue Wu,Bing Tu,Lin Zhang,Pan Pan,Min Lei
DOI: https://doi.org/10.1016/j.diamond.2024.111045
IF: 3.806
2024-03-01
Diamond and Related Materials
Abstract:Diamond and Invar were brazed with Ag-Cu-Ti filler alloy. Contact angle of the Ag-Cu-Ti/diamond system was measured, and its wetting behavior was explored. The interfacial structure of the joint was analyzed through brazing temperature and dwell time. The typical interfacial structure of diamond/Ag-Cu-Ti/Invar alloy brazed joints was diamond/TiC/Ag(s, s) + Cu(s, s)/Fe2Ti + Ni3Ti/Fe2Ti/Invar alloy. With increasing brazing temperature or dwell time, the thickness of the TiC layer and the quantity of Fe2Ti and Ni3Ti phases increase. The shear strength tests show that the maximum shear strength of 257.4 MPa was obtained with the parameters at 870 °C for 10 min. In addition, the impact of processing parameters on fracture location and fractographs of brazed joints was discussed.
materials science, multidisciplinary,physics, applied, condensed matter, coatings & films