Pattern Formation under Residual Compressive Stress in Free Sustained Aluminum Films

SJ Yu,QL Ye,YJ Zhang,PG Cai,XJ Xu,JX Chen,GX Ye
DOI: https://doi.org/10.1016/j.tsf.2005.03.057
IF: 2.1
2005-01-01
Thin Solid Films
Abstract:A nearly free sustained aluminum (Al) film system has been successfully fabricated by vapor phase deposition of Al atoms on silicone oil surfaces and an unusual type of ordered patterns at the micrometer scale has been systematically studied. The ordered patterns are composed of a large number of parallel key-shaped domains and possess a sandwiched structure. The nucleation and growth of the patterns are very susceptible to the growth period, deposition rate, nominal film thickness and location of the film. The experiment shows that the ordered patterns are induced by the residual compressive stress in the film owing to contraction of the liquid surface after deposition. The appearance of these stress relief patterns generally represents the stress distribution in the nearly free sustained Al films, which mainly results from the characteristic boundary condition and the nearly zero adhesion of the solid–liquid interface.
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