Cure Kinetics of Tgddm/Dds System Studied by Non-Isothermal Method

Zhao Weijuan,Zhang Zuoguang,Sun Zhijie,Zhang Daxing
DOI: https://doi.org/10.3724/sp.j.1105.2006.00564
2006-01-01
Abstract:4, 4'-tetraglycidyldiaminodiphenyl methane (TGDDM) epoxy resins are widely used in the fields of aviation and airspace owing to their excellent properties,but the physical proper-ties of the cured epoxy resins depend on their structure, the extent of cure, the curing conditions, the time and temperature of cure. So it is necessary to study the curing kinetics in order to obtain the optimal curing process. The Curing kinetics of TGDDM in presence of 313'-diaminodiphenylsylfone (DDS) as the curing agent was studies by differential scanning calorimetry (DSC) technique at different heating rates. The kinetic mechanism functioin was determined using n order reaction and the most probability mechanism functioin method given by Malek respectively, the kinetic parameters of curing reaction were determined with the kinetic analysis of the data obtained by the thermal treatment, then the kinetic model was built. The results indicated that the n order model deduced from Kissinger and Crane equation, by which the parameters of curing reaction, the reaction order and activity energy were obtained, had great distinction with the experimental data. While the Malek analytical mechanism showed that the curing process of the curing reactions followed an autocatalytic reaction. The two-paramet er (m, n) autocatalytic model can well describe the curing reaction processs of the studied epoxy resins. The DSC curves obtained using the experimental data showed a good agreement with that theoretically calculated under 5 similar to 20 K/min heating rate. The research results will provide theoretical basis for the choice of manufacturing process and the optimization of processing window.
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