Curing reaction characteristics of 840S epoxy resin

ZENG Xiuni,DUAN Yuexin
DOI: https://doi.org/10.3321/j.issn:1000-3851.2007.03.018
2007-01-01
Abstract:The kinetics of the cure reaction for a system of 840S epoxy resin was monitored by the Differential scanning calorimetry (DSC) and investigated by the constant heating methods. According to the DSC graphs, the curing process temperatures such as gelation temperature (Tgel), peak temperature (Tp) and treat temperature (Ttreat) were acquired using T-β graph extrapolation, and these temperatures play an important role in confirming the technical parameters of the molding process of the resin system. The kinetic parameters of the curing reaction of 840S epoxy resin such as the overall activation energy Ea, the frequency factor A and the value of reaction order n were obtained, and the kinetic model of the curing process based on n order reaction equation was set up using Kissinger and Crane equation. The characteristics of the curing reaction under dynamic and isothermal conditions is great useful for determining reasonable curing process parameters of the 840S epoxy resin system.
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