Abstract:Abstract Near-infrared (NIR, 0.7–1.4 µm) imagers have wide applications in night surveillance, material sorting, machine vision and potentially automatic driving. However, limited by the high-temperature processing and requirement of single-crystalline substrate, so far flip-chip is the dominant way to connect infrared photodiodes and silicon-based readout integrated circuit (ROIC) to produce infrared imagers, suffering from complicated process and ultra-high cost and hence limiting their widespread applications in the market. Here we report the monolithic integration of colloidal quantum dots (CQD) photodiodes with complementary metal-oxide-semiconductor (CMOS) ROIC, operating as a low-cost and high-performance imager. The CQD photodetector is well designed with a CMOS-compatible structure, demonstrating a response spectral range of 400–1300 nm, a detectivity of 2.1×1012 Jones at room temperature, a -3dB bandwidth of 140 kHz and a linear dynamic range over 100 dB. The CQD imager can identify materials, inspect apple scar and veins with a large size of 640×512 pixels and a spatial resolution of 40 lp/mm at a modulation transfer function of 50%. Monolithic integration significantly reduces the cost without sacrificing performance, thus providing huge potential for the ubiquitous deployment of infrared imagers.

Low Power Design of 128 × 128 IR ROIC

Low Power Design Orienting 384×288 Snapshot Infrared Readout Integrated Circuits

Novel Low Power QSBDI Structure for IR ROIC

Low Power Design Of Column Readout Stage For 320x288 Snapshot Infrared Roic

Novel Low Power Column Stage Design of 302 × 288 Infrared ROIC

A Low Power ROIC Design for 1024&#x00d7;1024 IRFPA

A low power ROIC design for 1024×1024 IRFPA

A Low Power Roic Design For 1024 X 1024 Irfpa

A Low Power High Speed ROIC Design for 1024&#x00d7;1024 IRFPA with Novel Readout Stage

A Low Power High Speed Readout Circuit for 320×320 IRFPA

A LOW POWER HIGH RESOLUTION ROIC DESIGN WITH 14-BIT COLUMN-LEVEL ADC FOR 384 × 288 IRFPA

Low Power Readout Integrated Circuit with PFM-based ADCs Employing Residue Quantization for Uncooled Infrared Imagers

Column-level Passive Sample and Column-Shared Active Readout Structure for High Speed, Low Power ROIC

A Low Power Readout Circuit for 640×512 IRFPA with Dynamic Windowing Readout

A Low-Power Single-Slope Based 14-Bit Column-Level ADC for 384×288 Uncooled Infrared Imager

A High-resolution Colloidal Quantum Dot Imager by Monolithic Integration

A Low Power High Linearity Cryogenic Readout Integrated Circuit with Large Charge Handling Capacity for 10 mu m Pitch 640x512 Infrared Focal Plane Array

Low Power Readout Circuit for 384×288 Uncooled IRFPA with Novel Readout Stage

A Novel Low-Power Readout Structure for Tdi Roic

The Design of a Low-Noise, High-Speed Readout-Integrated Circuit for Infrared Focal Plane Arrays

Two‐stage ADC‐based ROICs for 25 Μm‐pitch Cryogenic Infrared Focal Plane Array