Surface Treatment And Planarization
Pinyen Lin,Roya Maboudian,Carlo Carraro,Fan-Gang Tseng,Pen-Cheng Wang,Yongqing Lan
DOI: https://doi.org/10.1007/978-0-387-47318-5_13
2011-01-01
Abstract:Released structures, structures that move, free surfaces, and surfaces that contact one another in operation are all common in MEMS devices. Free surfaces on MEMS elements are crucial to device performance; hence, surface characteristics must be well controlled during release processes. In this chapter, materials and processes pertinent to device surfaces are discussed in seven main sections. Case studies and examples illustrate the processing details. The first section centers on release processes that create the free device surface, including surface treatments to prevent stiction. Tools for surface analysis are discussed in the second section, and the third section focuses on (undesired) adhesion of MEMS structures, i.e. stiction (Sections "Release Processes and Surface Treatments to Prevent Stiction", "Surface Analysis", and "Adhesion and Friction of MEMS", in this chapter).As MEMS diversify into chemical, analytical, and biomedical applications, MEMS devices interface with chemical and biological environments, making the free surface between MEMS elements and the environment crucial to performance. The chemistry of surface treatments and the variety of substrate materials constitute a distinct field for surface design and processing of MEMS devices. The functionalized surface must respond to changes in the environment and translate those changes into measurable signals. Accordingly, the fourth and fifth sections describe chemical and biological treatments to create appropriately functionalized surfaces (Sections "Chemical Modification of MEMS Surfaces" and "Surface Considerations for Biological Applications", in this chapter).As light interacts with MEMS devices, three optical parameters are relevant to performance: reflection, transmission, and absorption. The design of optical coatings to meet the optical requirements of MEMS applications is discussed in Section "Surface Coating for Optical Applications", in this chapter. The materials and processes for optical coating and surface requirements are also discussed.The final section, Section "Chemical Mechanical Planarization", in this chapter, concerns chemical mechanical planarization (CMP) for MEMS applications. MEMS structures with high aspect ratios are often created to achieve specific performance objectives, creating raised topography. CMP is required to level the surface for subsequent microlithography. Details of the CMP process for various materials and design criteria are also described.