Dipolar Alignment in a Ferroelectric Dielectric Layer of FeFETs to Boost Charge Mobility and Nonvolatile Memory
Dhrubojyoti Roy,Partho Sarathi Gooh Pattader,Dipankar Bandyopadhyay,Mohua Chakraborty,Chia-Hsin Wang,Yaw-Wen Yang,Manabendra Mukherjee
DOI: https://doi.org/10.1021/acsaelm.0c00549
IF: 4.494
2020-09-20
ACS Applied Electronic Materials
Abstract:Influence of dipolar alignments of a ferroelectric poly-vinylidine fluoride trifluroethylene [P(VDF-TrFE)] thin film on the charge mobility and nonvolatile property of ferroelectric field-effect transistors (FeFETs) has been explored. The electrical properties of the ferroelectric microstructures can be tuned by adopting different cooling procedures after annealing the spin-coated ferroelectric polymer P(VDF-TrFE) substrates. For example, a higher degree of alignment of the C–F dipoles in the polymeric chains is observed along the substrate surface for the samples with fast quenching. The dielectric constant of the fast-quenched sample is found to be ∼10 at 1 kHz, while the same is found to be ∼8.5 when the rate of cooling is relatively slower. Furthermore, the fabrication of a metal–insulator–metal capacitor using the fast-quenched substrate leads to a high remnant polarization of <i>P</i><sub>r</sub> ∼ 5.5 ± 0.2 μC/cm<sup>2</sup>, as compared to that of the normally cooled sample to ∼2.7 ± 0.2 μC/cm<sup>2</sup>, at an applied field intensity of 200 MV/m. Emergence of such characteristics encouraged the use of P(VDF-TrFE) as a gate dielectric layer, which leads to improved nonvolatile characteristics of the device. The measured charge carrier mobility of FeFETs embedded with a fast-quenched ferroelectric polymer as a gate dielectric is found to be ∼3.4 × 10<sup>–2</sup> cm<sup>2</sup> V<sup>–1</sup> s<sup>–1</sup>, which is ∼35% higher than the normally cooled samples. The strongly correlated C–F dipoles in the fast-quenched ferroelectric layers lead to the reduction in width of the trap density of states near the semiconductor–dielectric interface. The XPS and UPS characterizations show the formation of a superior transport channel in the semiconductor near its dielectric interface when the fast-quenched polymer is used as the gate dielectric in the FeFETs.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsaelm.0c00549?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsaelm.0c00549</a>.FESEM surface image of normally cooled and fast-quenched ferroelectric polymer thin films; AFM topographic image of CuPc nanoparticles on the Si substrate; band alignment study at the semiconductor–dielectric interface; and P(VDF-TrFE) film vibrational absorbance bands (<a class="ext-link" href="/doi/suppl/10.1021/acsaelm.0c00549/suppl_file/el0c00549_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.
materials science, multidisciplinary,engineering, electrical & electronic