Electroless Nickel Plating on Diamond/cu Composite Material for Electronic Packaging

WANG Hong-bo,JIA Cheng-chang,GUO Hong
2011-01-01
Abstract:The electroless nickel plating was used to improve the weldability of diamond/Cu composite.Before the electroless nickel plating,the pretreatment was applied to the surface of the composite by means of sensitization with SnCl2 solution and subsequent activation with PdCl2 solution.The influence of pH value and temperature on plating rate were studied.The SEM,EDX,XRD and scratching method were used to examined the coating.The results show that a uniform,compact and tight-bonded Ni-P coating could be plated on the surface of diamond/Cu composite.The coating is microcrystal,pertaining to medium phosphorous coating.
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