Abstract:This paper proposes a 24-29.5 GHz 2x2 transmit-ter (TX) and receiver (RX) front-end chipset with streamlinedintermediate frequency (IF) interfaces for digital beamforming(DBF) systems. An ultra-compact 90 degrees coupler employing a three-dimensional (3-D) coupling structure achieves a 70% reductionin size compared to typical Lange couplers while maintain-ing excellent performance. This 3-D 90 degrees coupler enables thesynthesis/distribution of IF I-Q signals within the transceiver(TRX), enhancing the feasibility of mmWave DBF by reducingthe demand for baseband channels and facilitating scalability formulti-beam arrays. To ensure a low-level error vector magnitude(EVM) in the TRX, the chipset employs joint package design foroptimal power and noise performance. It utilizes an image-rejectmixer to suppress RX image noise and introduces a DC-offsetin the single-sideband up-converter for LO leakage regulation.Additionally, a frequency doubler chain is incorporated toenhance phase noise performance. Fabricated using 0.13-mu m SiGe BiCMOS technology and packaged in WLCSP process, theTX achieves an average output 1-dB compression point (O P1d B)of 20 dBm per channel. The RX chip features a minimumnoise figure (NF) of 3.4 dB. Over-the-air (OTA) measurementsconducted over a 1.1-m distance reveal a transmission datarate of up to 8 Gb/s using 16-QAM modulation at 25 GHz.Furthermore, when employing a 400-MHz 64-QAM 5G NewRadio (NR) modulation, the system maintains EVM levels below-33 dB at 25 GHz and below -30 dB over 24-29.5 GHz

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