Preparation and Properties of Embedded Thick Film Multilayer Capacitor

Shi Jianzhang,Wang Hong,Shen Zhiyuan,Wang Nan,Yao Xi
DOI: https://doi.org/10.3321/j.issn:1002-185x.2007.z1.269
2007-01-01
Rare Metal Materials and Engineering
Abstract:A multilayer embedded capacitor was fabricated on the substrate of alumina ceramic(epsilon(r) =9.8)by screening printing, with low temperature co-fired ceramic BiNbO4(epsilon(r)=43) and Bi2O3-ZnO-Nb2O5(BZN, epsilon(r)=76)as dielectric materials, respectively. Its electricity parameters were tested and analyzed by HP4294A and its electrical properties were simulated and optimized by HFSS. The results show that the multilayer embedded capacitor is of high capacitance density C-0(717.5 similar to 744.3 pF/cm(2)), and its characteristic was quite stable. It foreshows extensively potential applications in the fields of mobile communication devices and microwave integrated circuits, etc.
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