Abstract:Chiplets integration offers a compelling value proposition for yield improvement, IP reuse, performance and cost optimization. Various advanced packaging technologies such as 2.5D Si TSV interposer, Fanout RDL organic interposer and 3D hybrid bonding have been deployed for chiplets and system heterogeneous integrations. Meanwhile, integrating multiple chiplets with diverse functions into a single package has also created a demand for advanced packages with higher density interconnects and larger footprint body sizes. How to optimize the layout to get the optimal performance among the chiplets has become very critical. In addition, high density and complex connectivity in advanced packaging cause more challenges by using traditional EDA tools for packaging design and assembly manufacturing validation. Furthermore, the die-to-die interconnects for chiplets integration are usually proprietary links from different customers, thus also create more design boundaries and limit the adoption of advanced packaging technology. In this paper, a new chip-to-package hybrid design platform for chiplets integration using advanced packaging technology was introduced. The design platform was utilized to complete the routings of ultra-high density I/O in 2.5D Si interposer and Fan-Out RDL organic interposer. Compared with the traditional package level design platform, the new hybrid design platform had reduced the design cycle time and improved design accuracy. Additionally, this platform had leveraged and validated the open standard Die-to-Die interconnects through the UCIe (Universal Chiplet Interconnect Express) ecosystem. Good electrical performance was achieved and met the requirements under the pin speed of 32Gbps for both fanout RDL organic interposer and 2.5D Si TSV advanced packaging technologies. Furthermore, a new packaging process design kit (PDK) had been developed to provide IC and system designers with advanced packaging design rules. Finally, this paper elaborated the design challenges and collaboration with system and IC design companies on chiplets integration from the perspective of OSATs.

Early Chip Planning Cockpit

Floorplanning Challenges in Early Chip Planning

Early-Stage Planning of Switched-Capacitor Converters in a Heterogeneous Chip

Early-Stage Power Grid Design: Extraction, Modeling and Optimization

Early-Stage Power Grid Design

A Cross-Layer Approach for Early-Stage Power Grid Design and Optimization.

RapidChiplet: A Toolchain for Rapid Design Space Exploration of Chiplet Architectures

3D architecture modeling and exploration

A Criticality-Driven Microarchitectural Three Dimensional (3D) Floorplanner

Advanced Packaging Design Platform for Chiplets and Heterogeneous Integration

A Layout Optimization Method to Reduce Commutation Inductance of Multi-Chip Power Module Based on Genetic Algorithm

Early Selection of System Implementation Choice among SoC, SoP and 3-D Integration.

Using Chip Multithreading to Speed Up Scenario-Based Design Space Exploration

Automated Communication and Floorplan-Aware Hardware/Software Co-Design for SoC

Floorplet: Performance-aware Floorplan Framework for Chiplet Integration

Fine Grain 3D Integration for Microarchitecture Design Through Cube Packing Exploration.

Automated Design of Chiplets

Modular High-Performance Computing Using Chiplets

Simultaneous Optimization Of Performance And Thermal Effects Based On Two-Stage Microarchitectural Floorplanning

Physical hierarchy exploration of 3D processors

An Automated Design Flow for 3D Microarchitecture Evaluation