Abstract:The multichip power module is an irreplaceable component for high-capacity industrial converters. Dynamic current imbalance among parallel chips challenges the electrothermal stability and limits the maximum current rating of the power module. In this paper, general mechanism models are proposed to reveal the layout-dominated dynamic current imbalance in the multichip power module. The influence of the layout on the current sharing is comparatively evaluated by power modules with and without Kelvin connections. Focusing on the dynamic current imbalance, based on a commercial multichip power module, finite-element analysis and equivalent electric circuit are utilized to illustrate the impact of Kelvin connection. General mathematical and graphical models are created to address the current sharing of parallel chips affected by networked parasitic impedances. Based on the fabricated power module prototypes, extensive experiments and detailed analyses are presented concerning the current sharing, transient time, and switching loss. It is demonstrated that the Kelvin connection can elevate switching speed and reduce switching loss of parallel chips, while its functionality to eliminate dynamic current imbalance depends on the parasitic impedances. Some general design guidelines of the multichip power module are presented for current sharing. To achieve satisfactory current sharing, advanced packaging layout by using the optimized chip arrangement and wire interconnection is further needed for the multichip power module.

A Layout Optimization Method to Reduce Commutation Inductance of Multi-Chip Power Module Based on Genetic Algorithm

Graph Model-Based Generative Layout Optimization for Heterogeneous SiC Multi-Chip Power Modules with Reduced and Balanced Parasitic Inductance

Graph-Model-Based Generative Layout Optimization for Heterogeneous SiC Multichip Power Modules with Reduced and Balanced Parasitic Inductance

Efficient layout design automation for multi‐chip SiC modules targeting small footprint and low parasitic

Design of Low Parasitic Inductance SiC MOSFETs Halfbridge Power Modules

A Cross-Layer Approach for Early-Stage Power Grid Design and Optimization.

Early-Stage Power Grid Design: Extraction, Modeling and Optimization

Electronic Components Placement Optimization under Thermo-Mechanical Loads

Chip Layout Optimization of SiC Power Modules Based on Multiobjective Electro-Thermal Design Strategy

A Simple Method to Evaluate Substrate Layout for Power Modules

Layout-Dominated Electro-Thermal Optimization for Multichip Power Modules with Response Surface and Fourier Series Model

Current-Bunch Concept for Parasitic-Oriented Extraction and Optimization of Multichip SiC Power Module

Design and Evaluation of SiC Multichip Power Module with Low and Symmetrical Inductance

Analysis of A Low-Inductance Packaging Layout for Full-Sic Power Module Embedding Split Damping

Design Method for Multichip Double-Sided Cooling Power Module with Multidimensional Self-and Mutual Inductances

Trade-Off-Oriented Impedance Optimization of Chiplet-Based 2.5-D Integrated Circuits with a Hybrid MDP Algorithm for Noise Elimination

Innovative Reverse Current Coupling Layout of SiC Power Module for Parasitic Inductance Reduction

Design and Current Balancing Optimization of A 1700V/1000A Multi-chip SiC Power Module

Optimal Stack Generation for CMOS Analog Modules with Parasitic and Mismatch Constraints

Optimization Of Inductor Based On Genetic Algorithm For The Medium Voltage Cascade Converter With Active Front End

Layout-Dominated Dynamic Current Imbalance in Multichip Power Module: Mechanism Modeling and Comparative Evaluation