Abstract:The interfacial reactions induced by vacuum furnace annealing and rapid thermal annealing in sequentially deposited Al/Ni bimetallic thin-film diffusion couples have been investigated with MeV 4He+ backscattering spectrometry, cross-sectional transmission electron microscopy, and Auger electron spectroscopy. Upon annealing, NiAl3 is the first aluminide phase to grow. In uncontaminated samples, the NiAl3 growth proceeds in uniform planar fashion, governed by diffusion-limited kinetics. The kinetics data fit well with those for NiAl3 growth on large-grained Al substrates, yielding a common kinetics law of x2=kt, where x is the thickness of the NiAl3 grown at the interface, t is the annealing duration, and k is the growth constant, which is given by k=2.24(cm2/s) exp(−1.5±0.1 eV/kBT), in which T is the annealing temperature and kB is the Boltzmann constant. Microscopic examination reveals slight nonuniformity at the Al/NiAl3 interface resulting from shallow local protrusions of NiAl3 grains into the Al layer at grain boundaries. When either the Al film or the Al/Ni interface is purposely contaminated during sample preparation, the roughness at this Al/NiAl3 interface becomes very pronounced, and the reaction rate is significantly reduced. Meanwhile, Ni motion becomes appreciable as NiAl3 grains and/or Ni severely penetrate the Al layer. In contrast, the NiAl3/Ni interface remains sharp in all samples. The irregular morphology and nonuniform reaction cannot be attributed uniquely to the presence of grain boundaries in the Al film, but rather are a combined effect of impurities and Al grain boundaries. Short-term rapid thermal annealing at elevated temperatures appreciably alleviates the nonuniformity at the Al/NiAl3 interface in contaminated samples.

Interface reactions of an Ag/Cr/AlN sandwich during annealing between 250 and 650 °C

Characterization of the Interface Region During the Agglomeration of Silicon Nanocrystals in Silicon Dioxide

Ag surface diffusion and out-of-bulk segregation in CrN-Ag nano-composite coatings

Observation on the Interface of Α-Al2o3/cr2o3: Prepared by Oxidation of Al45Cr7

Aes Study On The Interface Diffusion And Reaction Between Cr Layer And Si3n4/Si Substrate

INTERFACIAL REACTION BETWEEN Ti THIN FILM AND AlN CERAMIC

Post-deposition annealing effects on microstructure, mechanical and tribological properties of AlCrN films

Effects of Diamond/al Interface Structure Evolution on Interfacial Thermal Conductance During the Carbonization of the Cr Interlayer

Microstructure evolution of nanostructured Ni3Al during annealing

Structural evolution of Ag-Cu nano-alloys confined between AlN nano-layers upon fast heating

A Study on Annealing Treatment Under Various Temperatures for the Interfaces of Cu-Ag Composite Sheets

Study on Interfacial Reaction of Ti/AlN by SIMS, RBS and XRD

Effect of annealing on the microstructure, mechanical and electrochemical properties of CrAlC coatings

Influence of annealing on microstructures and mechanical properties of arc-deposited AlCrTiSiN coating

Elemental Diffusion Study of Ge/Al2O3 and Ge/AlN/Al2O3 Interfaces Upon Post Deposition Annealing

The Metallization and Interface Reaction Between Diamond Particle and Cr Layer

Microstructure and elemental distribution of multicrystal Ag/Cu interface in bimetallic strips with diffusion treatment

Thermal stability and selective nitridation of Cr2AlC in nitrogen at elevated temperatures

Effect of the Diffusion Annealing on Concentration Distributions in interfacial Regions of Au/Ag-Cu/Cu-Ni-Zn Laminate Strips

Thermal Stability of Microstructure and Hardness of Cold-Sprayed cBN/NiCrAl Nanocomposite Coating

Nial3 Formation in Al/Ni Thin-Film Bilayers with and Without Contamination