Progress in EMC

Tong-yun Bai

DOI: https://doi.org/10.3969/j.issn.1003-0107.2006.12.031

2007-01-01

Abstract:EMC design techniques and methodology have become as integral a part of design as,for example,digital design.This will no doubt increase in importance as the trend toward increased clock speeds and data rates of digital systems continues.

What problem does this paper attempt to address?

Recent Progress of Nano-Electromagnetic Compatibility (Nano-Emc) in the Emerging Carbon Nanoelectronics

Wen-Sheng Zhao,Da-Wei Wang,Alessandro Giuseppe D’aloia,Wenchao Chen,Gaofeng Wang,Wen-Yan Yin

DOI: https://doi.org/10.1109/memc.2018.8410686

2018-01-01

IEEE Electromagnetic Compatibility Magazine

Abstract:This paper presents a selection of research topics related to nano-electromagnetic compatibility (nano-EMC) issues in emerging carbon nanoelectronics. Carbon-based nano-interconnect modeling and analysis are first introduced. Then, the key techniques of carbon nanotube-filled through-silicon vias and carbon- based passive devices are discussed.
On-chip EMC issue: the implementation of patterned ground shields for silicon devices

Wenyan Yin

DOI: https://doi.org/10.1109/EMCZUR.2007.4388183

2007-01-01

Abstract:This paper addresses some on-chip EMC issues for reducing power dissipation in the design of passive silicon-based devices operating at high frequencies. It is demonstrated that the implementation of patterned ground shields (PGS) together with differential technique can enhance the performance of spiral inductors, spiral transformers, and other devices effectively, which is compatible with standard CMOS fabrication technologies. However, the shielding effectiveness of a PGS is very sensitive to its embedding depth which should be chosen carefully. Some numerical results will be shown to demonstrate inductive couplings in various PGS inductors and transformers but are suppressed here.
Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Er-Ping Li,Xing-Chang Wei,Andreas C. Cangellaris,En-Xiao Liu,Yao-Jiang Zhang,Marcello D'Amore,Joungho Kim,Toshio Sudo

DOI: https://doi.org/10.1109/temc.2010.2048755

IF: 2.036

2010-01-01

IEEE Transactions on Electromagnetic Compatibility

Abstract:The ever-increasing demands of digital computing and wireless communication have been driving the semiconductor technology to change with each passing day. Modern electronic systems integrate more complex components and devices, which results in a very complex electromagnetic (EM) field environment. EM compatibility has become one of the major issues in ICs redesign, mainly due to the lack of effi...
Advanced Parallel Algorithm for System-Level EMC Modeling of High-Speed Electronic Package

Er-Ping Li,X. C. Wei,En-Xiao Liu,Zaw

DOI: https://doi.org/10.1109/isemc.2008.4652145

2008-01-01

Abstract:This paper presents a novel algorithm for EMC simulation of electronic package integration. This algorithm is based on hybridizing method of moments with analytical method, modal expansion technique. The entire electronic package domain is divided into two networks: the signal distribution network and the power distribution network. The signal distribution network is simulated using the method of moments, where the equivalent RLCG (resistance, inductance, capacitance and conductance) parameters of the signal traces in the signal layers are extracted. The power distribution network is simulated by using the modal expansion technique, where the equivalent circuit of the power distribution network is obtained. It is straightforward to substitute all the extracted equivalent circuit parameters into a SPICE-like simulator to simultaneously perform the signal and power integrities analyses. With the proposed method, the system-level EMC modeling of the package can be performed efficiently. Numerical examples demonstrate that this approach is able to provide fast yet accurate simulation for signal and power integrities analysis of multilayered electronic packages. In order to further enhance the simulation efficiency, the parallel process of the proposed method is implemented in our institutepsilas high performance computer.
Recent Advances in Electromagnetic Compatibility of 3D-Ics — Part II

Etienne Sicard,Wu Jianfei,R. J. Shen,Er-Ping Li,En-Xiao Liu,J. Kim,Jonghyun Cho,Madhavan Swaminathan

DOI: https://doi.org/10.1109/memc.2016.7477137

2016-01-01

IEEE Electromagnetic Compatibility Magazine

Abstract:This second part addresses a selection of topics related to Electromagnetic interference (EMI) issues in three-dimensional integrated components. Details about Through Silicon Via TSV) technology, modelling and parasitic effects are introduced in the first part, then key concepts such as signal integrity (SI), power integrity (PI), and Electromagnetic Interference are introduced.
Research On Emc Problem In High-Speed Digital Clock Circuit

Weiming Tong,Zhong Zhang,Fengge Li

2010-01-01

Abstract:In high-speed digital circuits, the transmission quality of clock signal is the key factor whether the whole system can work normally. Crosstalk is the main interference factor in high-speed clock circuit. The crosstalk problem that disturbs the highspeed signal is researched. The EMC design method of high-speed clock circuit is proposed, and the measures to solve the crosstalk problem in high-speed clock circuit are given. The new design improves the anti-interference ability of digital clock circuit significantly.
Electro-Thermo-Mechanical Investigation On Multi-Level Interconnects In The Presence Of An Esd Pulse

Fanzhi Kong,Wenyan Yin,Junfa Mao,Qinghuo Liu

DOI: https://doi.org/10.1109/EDAPS.2008.4736026

2008-01-01

Abstract:Electro-thermo-mechanical transient investigation on multi-layer high-density interconnects in the presence of an ESD pulse is carried out using hybrid nonlinear time-domain finite element method (FEM). The pre-conditioned conjugated gradient technique (PCG) is combined with the element-by-element FEM so as to enhance our numerical analysis, where the temperature dispersion effects of electrical conductivity, thermal conductivity, coefficient of thermal expansion, and Young's modulus of the materials involved are all taken into account. Parasitic studies are performed to show time-dependent von Mises stress responses of some typical interconnects as the injection of an ESD current pulse, which can be fabricated using advanced semiconductor technologies, such as 90-, 60, and even 45-nm CMOS, etc.
Development of a Virtual Lab for EMC Application

Wang Binfang,Yik Hou Meng,Lim Boon Hui,Gao Xian Ke Richard,Zhao Huapeng,Li Er Ping

DOI: https://doi.org/10.1109/apemc.2012.6238021

2012-01-01

Abstract:In this article, we present the system development of Virtual EMC Lab (“Virtual Electromagnetic Compatibility Laboratory”). It is a toolkit developed for the electronic and electric product/system design, modelling, simulation, analysis, diagnosis and assessment tailored to the electromagnetic compatibility problems. The toolkit includes a solid modelling front-end which simplifies the geometrical structure of equipment under test (EUT), analytical and numerical solvers for different applications, and visualization tools. It is dedicated to solve electromagnetic interference, immunity and emission problems in board level and system level.
Special Issue On Emc In The Near-Field: Theory, Measurements, And Applications Foreword

Marcello D&#x;Amore,Perry F. Wilson,Er-Ping Li,Wen-Yan Yin

DOI: https://doi.org/10.1109/TEMC.2016.2641538

IF: 2.036

2017-01-01

IEEE Transactions on Electromagnetic Compatibility

Abstract:The papers in this special issue focus on theory, measurements, and applications for electromagnetics in near-field. Numerous electromagnetic compatibility (EMC) problems occur in the near-field (NF) where far-field (FF) concepts, measurement techniques, and equipment may not provide correct insight and solutions. The ability to identify near-field effects when assessing EMC problems is important to both researchers and practitioners alike. Applications of advanced technologies, which are characterized by new materials and rapidly increasing frequencies, in different civil, industrial, and military areas highlight the importance of NF techniques. This issue examines recent research on NF theoretical approaches, computational models, and measurement techniques in light of EMC goals.
Computational Electromagnetics for Nanodevices

Li, Erping

DOI: https://doi.org/10.1049/cp.2011.0008

2011-01-01

Abstract:Technological advancements have driven the humanity for the past five decades. In many of these technological advances, computational electromagnetics has played a major role. From the design of aeroplanes down to consumer electronics, the field of computational electromagnetics has been growing steadily in terms of maturity, complexity, as well as performance. However, innovation does not seem to slow down anytime soon. The dimension of technological devices continues to shrink down to nano scale. This also results in an ongoing research in the field of nano photonics to bring the speed of light down to the nano scale regime and integrate them with electronics. All these new advances demand a new and further development of current techniques for computational electromagnetics. In this paper, we will present some of our works that tackles the issue of computational electromagnetics as it is applied to nanoscale devices.
EMC Design of PCB Pole

WANG Wei-Jian

DOI: https://doi.org/10.3969/j.issn.1002-6673.2010.03.019

2010-01-01

Abstract:Mainly on the printed board discussed the issue of electromagnetic compatibility,Including the principle of multi-layer PCB design,Printed line spacing and margins、 Ground,bypass capacitors and decoupling capacitors、 EMC design of the clock circuit,etc。 EMC is the proposed means of ensuring product performance,but also clean environment.
Impact of Technological Trends and Electromagnetic Compatibility of Integrated Circuits

E. Sicard,A. Boyer

2019-10-21

Abstract:This paper introduces the main trends in the integrated circuit manufacturing industry, the driving forces in relation to complexity, operating frequency, device performance, trends in supply voltages and data rate exchange between devices. The roadmap summarizes IC performance in terms of technology nodes, ranging from µm to nano scales and targeting CMOS technology. The consequences of this technological evolution on Electromagnetic Compatibility (EMC) of ICs are also discussed. Finally, a review of recent research in EMC of ICs is proposed through a selection of recent scientific papers published these last three years.

Computer Science,Physics,Engineering
Automobile Electronic Systems Electromagnetic Compatibility Designs Practices

Bai Tong-yun

DOI: https://doi.org/10.3969/j.issn.1003-0107.2008.11.026

2008-01-01

Abstract:Now more and more high-tech electronic products are opened up and applied to automobile. It has become a very important research on how to resolve electromagnetic compatibility of automobile electronic systems and to improve reliability and security of automobile.
Stratification And Integration Method—The New Method for The Products' Electromagnetic Compatibility(EMC)Design

Bai Tong-yun

DOI: https://doi.org/10.3969/j.issn.1003-0107.2008.05.034

2008-01-01

Abstract:According to the importance of the measurements which are adopted in the design for new products,firstly we divide it into some stratification and design it.Then we analyse it with integration method and adjust it with proper way.This is the method which was issued in this paper. Electromagnetic Compatibility(EMC) Design is the importance to realize the specified functions and make full use of the performance of a new product.So electromagnetic compatibility design has become one of the most characteristics of a product. The goal of electromagnetic compatibility design is to make the product have the characteristic of electromagnefic compatibility. On the one hand,the product can work in the preliminary electromagnetic circumstance and not lower its performance or have malfunction.On the other hand,the electromagnetic circumstance can not be a pollution source,that is to say the product can fulfill the respective criterion and get the licorice for manufacturing and marketing。
Signal Propagation Effects on High‐speed Interconnection Lines Using Time‐domain Numerical Technique

EP Li,WL Yuan,S Wang

DOI: https://doi.org/10.1002/mop.10624

IF: 1.311

2002-01-01

Microwave and Optical Technology Letters

Abstract:With advancements in microelectronics, interest in electromagnetic interference and compatibility in high-speed circuits has greatly increased in the engineering community and application of computational electromagnetics to electromagnetic interference and compatibility (EMI/EMC) engineering has become an emerging technology. Termination, via, and crosstalk on interconnection lines raises EMI problems in high-speed circuits and requires attention during design phases for signal integrity. This paper analyzes signal propagation effects among different parts of high-speed interconnection lines using the finite-difference time-domain (FDTD) method. The mechanism and the effectiveness of control measures are examined, which can be applied to high-speed circuit designs. (C) 2002 Wiley Periodicals, Inc.
Upgraded EMC Modelling of Dual Die Structure

Boyuan Zhu,Junwei Lu,Sascha Stegen,Erping Li

DOI: https://doi.org/10.1109/emcsa.2009.5349765

2009-01-01

Abstract:Due to the variety of internal structures applied in different processors, EMC modelling should also be upgraded correspondingly. This paper presents an upgraded EMC simulation model of dual die structure which is originated from the IEEE electromagnetic challenging problem 2000-4 for conventional CPU with heatsink. The simulation results are verified by measurement with a fabricated model. Furthermore, a consequent benchmark will be provided.
Signal Integrity Simulation and Analysis in High-Speed Interconnects by Using FDTD

EP Li,WL Yuan

DOI: https://doi.org/10.1109/elmagc.2002.1177422

2002-01-01

Abstract:With the advancements in microelectronics, interest in electromagnetic interference and compatibility in high-speed circuits has greatly increased in the engineering community, and applications of computational electromagnetics to electromagnetic interference and compatibility (EMI/EMC) engineering become an emerging technology. Termination, via, and crosstalk on interconnection lines will raise EMI problems in high-speed circuits and will therefore require more attention during the design phase for signal integrity. This paper presents signal propagation effect analysis on high-speed interconnection lines, between different parts, with the finite-difference time-domain method. The mechanisms and effectiveness of control measures are examined, which could be applied to high-speed circuit design.
Study and Application of EMC in Test System

董国光,许黎明,胡德金

DOI: https://doi.org/10.3969/j.issn.1001-5531.2004.06.015

2004-01-01

Abstract:EMC (electromagnetic compatibility) has an important role in the process of developing test system. In this article,the approaches of anti-interference were presented. Some of them have been applied in a new kind of performance test equipment for electric tools and have shown satisfactory effects.
A Novel and Powerful TCAD Methodology to Evaluate Performance of ESD Protection Devices

Yan Han,Shaoyu Ma,Qiang Cui,J.J. Liou,Shurong Dong

DOI: https://doi.org/10.1049/cp:20070677

2007-01-01

Abstract:On-chip electrostatic discharge (ESD) protection requires not only extensive technical experience but also scientific technology computer aided design (TCAD) methodology for evaluation. A novel and powerful TCAD methodology aimed to evaluate performance of ESD protection devices objectively is developed and presented. Mix-mode transient circuit simulation, which depicts ESD events better, is acquired in this simulation method. This TCAD methodology pays more attentions to the transient behaviors and characteristics of ESD protection devices which are more valuable to predict performance of ESD protection devices. This TCAD methodology with good ability of convergence can evaluate the performance of ESD protection devices scientificly and has strong direction ability to the design of ESD protection devices.
State of Art of Electromagnetic Compatibility Research on Power Electronic Equipment

Qian Zhaoming,Chen Henglin

DOI: https://doi.org/10.19595/j.cnki.1000-6753.tces.2007.07.001

2007-01-01

Abstract:With the implementation of electromagnetic compatibility (EMC) regulations, EMC related issues have attracted increasing attentions in power electronics field. This paper reviews recent achievements of the research on EMC/EMI (electromagnetic interference) problems in power electronic equipment. Research activities on EMI modeling and suppression techniques for power converters and motor drives, parasitic effects of EMI filter, PCB layout, and numerical techniques for EMI analysis are discussed briefly. Development trends for EMC research on power electronic equipment are also analyzed.

Progress in EMC

Recent Progress of Nano-Electromagnetic Compatibility (Nano-Emc) in the Emerging Carbon Nanoelectronics

On-chip EMC issue: the implementation of patterned ground shields for silicon devices

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Advanced Parallel Algorithm for System-Level EMC Modeling of High-Speed Electronic Package

Recent Advances in Electromagnetic Compatibility of 3D-Ics — Part II

Research On Emc Problem In High-Speed Digital Clock Circuit

Electro-Thermo-Mechanical Investigation On Multi-Level Interconnects In The Presence Of An Esd Pulse

Development of a Virtual Lab for EMC Application

Special Issue On Emc In The Near-Field: Theory, Measurements, And Applications Foreword

Computational Electromagnetics for Nanodevices

EMC Design of PCB Pole

Impact of Technological Trends and Electromagnetic Compatibility of Integrated Circuits

Automobile Electronic Systems Electromagnetic Compatibility Designs Practices

Stratification And Integration Method—The New Method for The Products' Electromagnetic Compatibility(EMC)Design

Signal Propagation Effects on High‐speed Interconnection Lines Using Time‐domain Numerical Technique

Upgraded EMC Modelling of Dual Die Structure

Signal Integrity Simulation and Analysis in High-Speed Interconnects by Using FDTD

Study and Application of EMC in Test System

A Novel and Powerful TCAD Methodology to Evaluate Performance of ESD Protection Devices

State of Art of Electromagnetic Compatibility Research on Power Electronic Equipment