Liquid cooling system for battery modules with boron nitride based thermal conductivity silicone grease

Xin Ge,Youpeng Chen,Weidong Liu,Guoqing Zhang,Xinxi Li,Jianfang Ge,Canbing Li
DOI: https://doi.org/10.1039/d1ra08929c
IF: 4.036
2022-01-01
RSC Advances
Abstract:Heat-conductive silicone grease (HCSG), one of the most common composite thermal interface materials (TIMs) used in many advanced applications, is limited by its low thermal conductivity (TC).
chemistry, multidisciplinary
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