Abstract:Conventional photolithography, due to its scalability, robustness, and straightforward processes, has been widely applied to micro- and nanostructure manufacturing in electronics, optics, and biology. However, optical diffraction limits the ultimate resolution of conventional photolithography, which hinders its potential in nanoscale patterning for broader applications. Here, we introduce a derivative of conventional photolithography for nanoscale patterning called dual-layer photolithography (DLPL), which is based on the controlled exposure and development of overlapping positive and negative photoresists. In a typical experiment, substrates are sequentially coated by two layers of photoresists (both positive and negative). Then, we purposefully control the exposure time to generate slightly larger features in the positive photoresist than those in the negative photoresist. After development, their overlapping areas become the final features, which outline the original features. We demonstrate line widths down to 300 nm here, which can be readily improved with more precise control. By adjusting the lithography parameters and material deposition, the feature sizes, shapes (e.g., rings, numbers, letters), line widths (300-900 nm), and materials (e.g., SiO2, Cr, and Ag) of these features can be independently controlled. Combined with anisotropic etching, more complex three-dimensional nanostructures can be fabricated as well, as we demonstrate here with Si. We further fabricate photodetectors as an example application to show that these nanostructures fabricated by DLPL can be used to promote light-trapping MAPbI3 perovskite films to achieve good photoelectric properties. This strategy is not limited to ultraviolet photolithography and may also be incorporated into other energetic beam-based lithographic approaches, including deep and extreme ultraviolet photolithographies and electron beam lithography, to enhance their resolution.

Analysis of Fabricating Arbitrary Nanoscale Patterns by LSPP Direct Writing Lithography with Two-Dimensional Metal Hole-Array

High-throughput and Parallel Direct Laser Writing System Based on Screen Division Multiplexing of Spatial Light Modulator

High Throughput Laser Nano Direct Writing Technique

Peripheral-photoinhibition-based Direct Laser Writing with Isotropic 30 Nm Feature Size Using a Pseudo 3D Hollow Focus

Multiple-Patterning Nanosphere Lithography for Fabricating Periodic Three-Dimensional Hierarchical Nanostructures.

Laser Direct Writing Using Submicron-Diameter Fibers.

Direct Laser Writing Breaking Diffraction Barrier Based on Two-Focus Parallel Peripheral-Photoinhibition Lithography

Design and analysis of surface plasmon lithography direct-writing head for high exposure depth

High Depth-of-Field Nanostructures by Rotational Near-Field Photolithography

High-Speed Parallel Plasmonic Direct-Writing Nanolithography Using Metasurface-Based Plasmonic Lens

Multi-Focal Laser Direct Writing through Spatial Light Modulation Guided by Scalable Vector Graphics

Surface-plasmon-polaritons-assisted nanolithography with dual-wavelength illumination for high exposure depth.

Beam Pen Lithography.

Multifocal laser direct writing through spatial light modulation guided by scalable vector graphics

Single-Step Dual-Layer Photolithography for Tunable and Scalable Nanopatterning

Subwavelength Patterning Based On A Surface Plasmon Resonant Cavity

Parallel Laser Micro/Nano‐Processing for Functional Device Fabrication

Parallel Direct Laser Writing of Micro-Optical and Photonic Structures Using Spatial Light Modulator

Two Dimensional Nanoarray Fabricated by Near-Field Lithography Technology Based on Surface Plasmon

193 Nm Interference Nanolithography Based On Spp

Direct Nanopatterning of Complex 3D Surfaces and Self-Aligned Superlattices via Molecular-Beam Holographic Lithography