Abstract:With the miniaturization and multi-functionalization of electronic devices, a large number of electronic components with various requirements on the interconnections and packaging need to be integrated on one substrate. There are specific cases when it is necessary to use a series of solders with the melting points in a wide range. The repetitive and lengthy heating in the sequential reflow soldering leads to the overgrowth of the brittle intermetallic compound at the interface and inevitable thermal damage to the substrates. The high density in energy input and the small heat affected area enable laser soldering to make reliable interconnections using solders with different melting points on the same substrate. And the laser with a wavelength in the visible range can further improve the energy absorption of the solders. In this paper, experiments were carried out by both the laser soldering and the infrared reflow soldering on the tinned copper pads using Sn-based solders with the melting point ranging from 96 to 309 degrees C. A continuous wave solid-state laser with a wavelength of 532 nm and a relatively low power of 1.8 W was applied to all the samples. The wettability of solders, the mechanical properties and the microstructures of the joints were investigated. With better wettability induced by high superheating, reliable joints using solders with significantly different melting points on one substrate have been successfully achieved by the laser. When using Sn16-Pb32-Bi52, Sn42-Bi58 and Sn10-Pb88-Ag2, refined microstructure in the solder bumps resulted in the improved mechanical properties of the laser soldered joints. The fast cooling rate in the laser soldering lead to the non-equilibrium solidification in the eutectic Sn63-Pb37. The increase in the precipitation of Pb-rich phases gave rise to a slight decrease in the shear strength of laser soldered joints.

Microstructure of Eutectic 80au/20sn Solder Joint in Laser Diode Package

Effect of Microstructure of Au80Sn20 Solder on the Thermal Resistance TO56 Packaged GaN-based Laser Diodes

Laser Soldering of Sn-based Solders with Different Melting Points

Microstructural Evolution and Shear Performance of AuSn20 Solder Joint under Gamma-Ray Irradiation and Thermal Cycling

Intermetallic Compounds Formation at Interface Between Pbga Solder Ball and Au/Ni/Cu/Bt Pcb Substrate after Laser Reflow Processes

Comparative study of solder wettability on aluminum substrate and microstructure-properties of Cu-based component/aluminum laser soldering joint

Sagging Phenomenon of Micro-Solder Joints Fabricated by Laser Reflow Process

Oxidation and Au‐Sn Reaction of Laser Reflowed Micro‐solder Joints Protected by N2 or Exposed to Air Atmosphere

Effect of Au-Sn IMCs’ formation and morphologies on shear properties of laser reflowed micro-solder joints

Formation and change of AuSn4 compounds at interface between PBGA solder ball and Au/Ni/Cu metallization during laser and infra-red reflow soldering

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows

Evolution of AuSnx Intermetallic Components in Laser Reflowed Right-angled Solder Joints During Isothermal Aging Process

Effects of Package Geometry on Thermal Fatigue Life and Microstructure of Sn–Ag–Cu Solder Joint

Characteristic morphologies that cause failure of Au80Sn20/AlN substrate solder joint under combined temperature cycle and current switch cycle tests

Research on Microstructure and Shear Behavior of Au/Sn-Ag-Cu/Cu Lead-free Solder Joints at Different Soldering Temperatures

Effect of Laser Input Energy on AuSnx Intermetallic Compounds Formation in Solder Joints with Different Thickness of Au Surface Finish on Pads

Microstructure Characterization and Interfacial Reactions between Au-Sn Solder and Different Back Metallization Systems of GaAs MMICs

Effect Of Laser Input Energy On Wetting Areas Of Solder And Formation Of Intermetallic Compounds At Sn-3.5ag-0.75cu/Au Right-Angled Joint Interface

Interfacial Reaction between Lead-free Solder Ball and Au/Ni/Cu Pad during Laser Reflow Soldering

Evolution Of Intermetallic Compounds At Interface Between Pbga Solder Ball And Pads During Laser Reflow Soldering