Nanoimprint Technology for Fabrication of Three-Terminal Ballistic Junction Devices in GaInAs/InP

I Maximov,P Carlberg,I Shorubalko,D Wallin,EL Sarwe,M Beck,M Graczyk,W Seifert,HQ Xu,L Montelius,L Samuelson
DOI: https://doi.org/10.1016/s0167-9317(03)00071-6
IF: 2.3
2003-01-01
Microelectronic Engineering
Abstract:We present processing technology based on nanoimprint lithography (NIL) and wet etching for fabrication of GaInAs/InP three-terminal ballistic junction (TBJ) devices. To transfer sub-100 nm features into a high-mobility InP-based 2DEG material, we used SiO 2 /Si stamps made with electron beam lithography and reactive ion etching. After the NIL, the resist residues are removed in oxygen plasma followed by wet etching of GaInAs/InP to define the TBJ-structures. Fabricated TBJ-devices are characterized using scanning electron microscopy and electron transport measurements. Highly non-linear electrical characteristics of the TBJ structures are demonstrated and compared with E-beam defined devices.
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